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Title: Line-of-sight deposition method

Abstract

A line-of-sight method of depositing a film having substantially 100% of theoretical density on a substrate. A pressure vessel contains a target source having a surface thereof capable of emitting particles therefrom and a substrate with the source surface and the substrate surface positioned such that the source surface is substantially parallel to the direction of the particles impinging upon the substrate surface, the distance between the most remote portion of the substrate surface receiving the particles and the source surface emitting the particles in a direction parallel to the substrate surface being relatively small. The pressure in the vessel is maintained less than about 5 microns to prevent scattering and permit line-of-sight deposition. By this method the angles of incidence of the particles impinging upon the substrate surface are in the range of from about 45.degree. to 90.degree. even when the target surface area is greatly expanded to increase the deposition rate.

Inventors:
 [1];  [1];  [2]
  1. Richland, WA
  2. West Richland, WA
Issue Date:
Research Org.:
Battelle Memorial Institute, Columbus, OH (United States)
OSTI Identifier:
864075
Patent Number(s):
4305801
Assignee:
United States of America as represented by United States (Washington, DC)
Patent Classifications (CPCs):
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
DOE Contract Number:  
AC06-76RL01830
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
line-of-sight; deposition; method; depositing; film; substantially; 100; theoretical; density; substrate; pressure; vessel; contains; target; source; surface; capable; emitting; particles; therefrom; positioned; parallel; direction; impinging; distance; remote; portion; receiving; relatively; maintained; microns; prevent; scattering; permit; angles; incidence; range; 45; degree; 90; greatly; expanded; increase; rate; articles therefrom; particles therefrom; vessel contains; deposition method; theoretical density; pressure vessel; substrate surface; target surface; substantially parallel; deposition rate; direction parallel; surface emitting; /204/427/

Citation Formats

Patten, James W, McClanahan, Edwin D, and Bayne, Michael A. Line-of-sight deposition method. United States: N. p., 1981. Web.
Patten, James W, McClanahan, Edwin D, & Bayne, Michael A. Line-of-sight deposition method. United States.
Patten, James W, McClanahan, Edwin D, and Bayne, Michael A. Thu . "Line-of-sight deposition method". United States. https://www.osti.gov/servlets/purl/864075.
@article{osti_864075,
title = {Line-of-sight deposition method},
author = {Patten, James W and McClanahan, Edwin D and Bayne, Michael A},
abstractNote = {A line-of-sight method of depositing a film having substantially 100% of theoretical density on a substrate. A pressure vessel contains a target source having a surface thereof capable of emitting particles therefrom and a substrate with the source surface and the substrate surface positioned such that the source surface is substantially parallel to the direction of the particles impinging upon the substrate surface, the distance between the most remote portion of the substrate surface receiving the particles and the source surface emitting the particles in a direction parallel to the substrate surface being relatively small. The pressure in the vessel is maintained less than about 5 microns to prevent scattering and permit line-of-sight deposition. By this method the angles of incidence of the particles impinging upon the substrate surface are in the range of from about 45.degree. to 90.degree. even when the target surface area is greatly expanded to increase the deposition rate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Thu Jan 01 00:00:00 EST 1981},
month = {Thu Jan 01 00:00:00 EST 1981}
}