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Title: Printed circuit board for integrated LED driver

Abstract

A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.

Inventors:
; ; ;
Issue Date:
Research Org.:
Lumileds LLC, San Jose, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1771701
Patent Number(s):
10856376
Application Number:
16/184,565
Assignee:
Lumileds LLC (San Jose, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01R - ELECTRICALLY-CONDUCTIVE CONNECTIONS
DOE Contract Number:  
EE0006703
Resource Type:
Patent
Resource Relation:
Patent File Date: 11/08/2018
Country of Publication:
United States
Language:
English

Citation Formats

Song, Zhihua, Soer, Wouter Anthon, Bonne, Ron, and Qiu, Yifeng. Printed circuit board for integrated LED driver. United States: N. p., 2020. Web.
Song, Zhihua, Soer, Wouter Anthon, Bonne, Ron, & Qiu, Yifeng. Printed circuit board for integrated LED driver. United States.
Song, Zhihua, Soer, Wouter Anthon, Bonne, Ron, and Qiu, Yifeng. Tue . "Printed circuit board for integrated LED driver". United States. https://www.osti.gov/servlets/purl/1771701.
@article{osti_1771701,
title = {Printed circuit board for integrated LED driver},
author = {Song, Zhihua and Soer, Wouter Anthon and Bonne, Ron and Qiu, Yifeng},
abstractNote = {A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Dec 01 00:00:00 EST 2020},
month = {Tue Dec 01 00:00:00 EST 2020}
}

Works referenced in this record:

Receiving Device
patent-application, March 2007


Method for fabricating metal core layers for a multi-layer circuit board
patent, October 1992


High Frequency Circuit Module
patent-application, December 2006


Lighting Device and Method
patent-application, October 2003


Multilayer Electronic Structure with Integral Faraday Shielding
patent-application, December 2013


Photoelectric Mixed Substrate and Optical Module
patent-application, December 2014


High Frequency Module Board Device
patent-application, February 2004


Technique for interconnecting multilayer circuit boards
patent, November 2004


Light Emitting Diode (LED) Lighting Device
patent-application, June 2017


Addressable color changeable LED structure
patent, September 2019


Electrical Component Resin, Semiconductor Device, and Substrate
patent-application, February 2014


Display Panel With Board Mounted Power Supply
patent-application, April 2019


Integrated Flip Chip Device Array
patent-application, April 2017


Glass ceramic board
patent, July 2002


Composite Laminated Ceramic Electronic Component
patent-application, January 2015


Multilayer circuit board fabrication process
patent, April 1990


Switching Device Integrated with Light Emitting Device
patent-application, October 2008


Module and Process for Production Thereof
patent-application, July 2012


Multi-layer Circuit Assembly and Process for Preparing the Same
patent-application, October 2007


Thin Film Surface Mount Components
patent-application, April 2011


Metal Core Substrate Packaging
patent-application, June 2004


Partitioned Hybrid Substrate for Radio Frequency Applications
patent-application, January 2015


Light Emitting Diode Module and Display Device Having the Same
patent-application, August 2008


High-frequency wiring board
patent, April 2004


Method for Making Tunable Multi-Led Emitter Module
patent-application, March 2019


Interconnect structures for assembly of multi-layer semiconductor devices
patent, November 2017


Multi-layer Electronic Part Built-in Board
patent-application, May 2008


Multilayer Circuit Board and Method for Manufacturing the Same
patent-application, November 2015


Light Source and Method for Producing the Light Source
patent-application, December 2015


High-frequency Module and its Manufacturing Method
patent-application, August 2003


High frequency circuit having a microstrip resonance element
patent, July 1988


Printed Circuit Boards Including Strip-Line Circuitry and Methods of Manufacturing Same
patent-application, July 2013


Electronic substrate, power module and motor driver
patent, October 2006


Ceramic laminated circuit substrate
patent, March 1991


System and Method of Forming a Patterned Conformal Structure
patent-application, May 2010


Method of manufacturing a multilayer circuit board
patent, January 1994


LED Module
patent-application, August 2014


Printed-circuit Board and Electronic Device
patent-application, September 2005


Compact Emitter for Warm Dimming and Color Tunable Lamp
patent-application, May 2016


Metal-base multilayer circuit substrate having a heat conductive adhesive layer
patent, January 2001


Substrate Structure Integrated with Passive Components
patent-application, January 2008


Composite laminate circuit structure and method of forming the same
patent, January 2001


Multi layer printed circuit board
patent, May 2002


Low-EMI Electronic Apparatus, Low-EMI Circuit Board, and Method of Manufacturing the Low-EMI Circuit Board
patent-application, February 2002


Metal constrained circuit board side to side interconnection technique
patent, October 1998


Printed Circuit Board for Mobile Platforms
patent-application, August 2013


Substrate Structure and Manufacturing Method Thereof
patent-application, July 2017


Make-before-break ADSL/VDSL Splitter Card
patent-application, January 2006


Self Shielded System in Package (SiP) Modules
patent-application, January 2017


Composite Type LED Circuit Board and Manufacturing Method
patent-application, June 2017


Mounting Arrangement for Lighting Devices, Corresponding Lighting Devices and Method
patent-application, August 2011


Printed Circuit Board for Integrated LED Driver
patent-application, January 2018


Connection Member and Mount Assembly and Production Method of the Same
patent-application, August 2005


Solid interface module
patent, December 2001


Illumination system
patent, January 2007


High Frequency Module
patent-application, May 2007