Printed circuit board for integrated LED driver
Abstract
A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.
- Inventors:
- Issue Date:
- Research Org.:
- Lumileds LLC, San Jose, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1771701
- Patent Number(s):
- 10856376
- Application Number:
- 16/184,565
- Assignee:
- Lumileds LLC (San Jose, CA)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01R - ELECTRICALLY-CONDUCTIVE CONNECTIONS
- DOE Contract Number:
- EE0006703
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 11/08/2018
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Song, Zhihua, Soer, Wouter Anthon, Bonne, Ron, and Qiu, Yifeng. Printed circuit board for integrated LED driver. United States: N. p., 2020.
Web.
Song, Zhihua, Soer, Wouter Anthon, Bonne, Ron, & Qiu, Yifeng. Printed circuit board for integrated LED driver. United States.
Song, Zhihua, Soer, Wouter Anthon, Bonne, Ron, and Qiu, Yifeng. Tue .
"Printed circuit board for integrated LED driver". United States. https://www.osti.gov/servlets/purl/1771701.
@article{osti_1771701,
title = {Printed circuit board for integrated LED driver},
author = {Song, Zhihua and Soer, Wouter Anthon and Bonne, Ron and Qiu, Yifeng},
abstractNote = {A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Dec 01 00:00:00 EST 2020},
month = {Tue Dec 01 00:00:00 EST 2020}
}
Works referenced in this record:
Receiving Device
patent-application, March 2007
- Isoda, Hiroshi
- US Patent Application 11/515763; 20070069932
Method for fabricating metal core layers for a multi-layer circuit board
patent, October 1992
- Brauer, John M.; Christie, Frederick R.; Lawrence, William H.
- US Patent Document 5,153,986
High Frequency Circuit Module
patent-application, December 2006
- Shih, Cheng-Yen
- US Patent Application 11/472480; 20060291178
Lighting Device and Method
patent-application, October 2003
- Martter, Robert H.; Sundberg, Craig C.; Giardina, Richard N.
- US Patent Application 10/120158; 20030193055
Multilayer Electronic Structure with Integral Faraday Shielding
patent-application, December 2013
- Hurwitz, Dror
- US Patent Application13/483207; 20130322029
Photoelectric Mixed Substrate and Optical Module
patent-application, December 2014
- Yanagisawa, Kenji
- US Patent Application 14/296777; 20140369642
High Frequency Module Board Device
patent-application, February 2004
- Ogino, Tatsuya; Okubora, Akihiko; Hirabayashi, Takayuki
- US Patent Application 10/416683; 20040034489
Technique for interconnecting multilayer circuit boards
patent, November 2004
- Kwong, Herman; Wyrzykowska, Aneta; Difilippo, Luigi
- US Patent Document 6,817,870
Light Emitting Diode (LED) Lighting Device
patent-application, June 2017
- Yanwei, Shen
- US Patent Application 15/042246; 20170159891
Addressable color changeable LED structure
patent, September 2019
- Vampola, Kenneth
- US Patent Document 10,400,958
Electrical Component Resin, Semiconductor Device, and Substrate
patent-application, February 2014
- Minamio, Masanori; Ikeuchi, Hiroki
- US Patent Application13/994253; 20140054077
Display Panel With Board Mounted Power Supply
patent-application, April 2019
- Foster, Matthew
- US Patent Application 15/793333; 20190123094
Integrated Flip Chip Device Array
patent-application, April 2017
- Shur, Michael; Shatalov, Maxim S.; Dobrinsky, Alexander
- US Patent Application 15/283490; 20170095582
Glass ceramic board
patent, July 2002
- Nakai, Hideaki; Sunahara, Hirofumi; Sakamoto, Sadaaki
- US Patent Document 6,414,247
Composite Laminated Ceramic Electronic Component
patent-application, January 2015
- Adachi, Hiroshige; Fujita, Seiji; Kaneko, Kazuhiro
- US Patent Application 14/456440; 20150030830
Multilayer circuit board fabrication process
patent, April 1990
- Lake, Harold; Grandmont, Paul E.
- US Patent Document 4,915,983
Switching Device Integrated with Light Emitting Device
patent-application, October 2008
- Kumar, Rashmi; Karlicek, Robert F.
- US Patent Application 11/788347; 20080258695
Package for multiple light emitting diodes
patent, February 2013
- Yan, Xiantao
- US Patent Document 8,384,097
Module and Process for Production Thereof
patent-application, July 2012
- Kashiwagi, Takafumi; Sakai, Yukio; Tada, Nobuhiro
- US Patent Application 13/496907; 20120168214
Multi-layer Circuit Assembly and Process for Preparing the Same
patent-application, October 2007
- Olson, Kevin C.; Wang, Alan E.
- US Patent Application 11/760217; 20070226998
Thin Film Surface Mount Components
patent-application, April 2011
- Korony, Gheorghe; Ritter, Andrew P.
- US Patent Application 12/904315; 20110090665
Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing same
patent, November 2007
- Danoski, Charles E.; Memis, Irving; Rosser, Steven G.
- US Patent Document 7,294,791
Metal Core Substrate Packaging
patent-application, June 2004
- Guzek, John; Azimi, Hamid; Wood, Dustin
- US Patent Application 10/313932; 20040107569
Partitioned Hybrid Substrate for Radio Frequency Applications
patent-application, January 2015
- Yang, Dan; He, Song; Ren, Yuxing
- US Patent Application 13/941554; 20150016078
Light Emitting Diode Module and Display Device Having the Same
patent-application, August 2008
- Park, Mun-soo
- US Patent Application 12/011958; 20080185607
Processes for manufacturing printed wiring boards
patent, June 2010
- Vasoya, Kalu K.
- US Patent Document 7,730,613
Method for Making Tunable Multi-Led Emitter Module
patent-application, March 2019
- Yan, Xiantao; Lee, Kachun; Tahmassebi, David
- US Patent Application 16/193606; 20190090323
UV Light Emitting Diode Package and Light Emitting Diode Module Having the Same
patent-application, October 2017
- Won Cheol, Seo
- US Patent Application 15/469443; 20170288088
Interconnect structures for assembly of multi-layer semiconductor devices
patent, November 2017
- Das, Rabindra N.; Gouker, Mark A.; Gouker, Pascale
- US Patent Document 9,812,429
Multi-layer Electronic Part Built-in Board
patent-application, May 2008
- Itou, Dai; Itabashi, Tooru
- US Patent Application 11/984325; 20080117609
High frequency transmission line and high frequency board
patent, March 2007
- Shimoda, Hideaki
- US Patent Document 7,193,490
Multilayer Circuit Board and Method for Manufacturing the Same
patent-application, November 2015
- Wei, Chien-Cheng; Chiang, Ta-Hsiang
- US Patent Application 14/700229; 20150319868
Light Source and Method for Producing the Light Source
patent-application, December 2015
- Austerer, Maximillian; Koellner, Wolfgang
- US Patent Application 14/767666; 20150377437
High-frequency Module and its Manufacturing Method
patent-application, August 2003
- Hirabayashi, Takayuki; Kosemura, Takahiko; Okubora, Akihiko
- US Patent Application 10/312248; 20030151477
High frequency circuit having a microstrip resonance element
patent, July 1988
- Ishigaki, Isao; Yabuki, Hiroyuki; Makimoto, Mitsuo
- US Patent Document 4,758,922
Printed Circuit Boards Including Strip-Line Circuitry and Methods of Manufacturing Same
patent-application, July 2013
- Moul, Wayne L.; Behnke, Robert J.; Frushour, Scott E. M.
- US Patent Application 13/352978; 20130180763
Electronic substrate, power module and motor driver
patent, October 2006
- Morita, Koji; Yoshikawa, Takao; Murai, Takayuki
- US Patent Document 7,119,437
Ceramic laminated circuit substrate
patent, March 1991
- Shinohara, Hiroichi; Suzuki, Hideo; Ogihara, Satoru
- US Patent Document 4,998,159
Method for manufacture of multilayer circuit board
patent, February 1990
- Shipley, Charles R.
- US Patent Document 4,902,610
System and Method of Forming a Patterned Conformal Structure
patent-application, May 2010
- Kapusta, Christopher James; Cunningham, Donald Paul
- US Patent Application 12/263874; 20100108370
Method of manufacturing a multilayer circuit board
patent, January 1994
- Olenick, John A.; Daigle, Robert C.
- US Patent Document 5,274,912
LED Module
patent-application, August 2014
- Singer, Frank; Zitzlsperger, Michael; Groetsch, Stefan
- US Patent Application 14/346687; 20140231837
Printed-circuit Board and Electronic Device
patent-application, September 2005
- Hiratsuka, Yoshiaki; Tanaka, Yoshiro
- US Patent Application 11/017712; 20050213309
Compact Emitter for Warm Dimming and Color Tunable Lamp
patent-application, May 2016
- Yan, Xiantao; Lee, Kachun
- US Patent Application 14/952648; 20160149088
Metal-base multilayer circuit substrate having a heat conductive adhesive layer
patent, January 2001
- Saitoh, Tohru; Yonemura, Naomi; Miyakoshi, Tomohiro
- US Patent Document 6,175,084
Substrate Structure Integrated with Passive Components
patent-application, January 2008
- Hsu, Shih-Ping
- US Patent Application 11/881547; 20080024998
Composite laminate circuit structure and method of forming the same
patent, January 2001
- Keesler, Ross W.; Markovich, Voya R.; Paoletti, Jim P.
- US Patent Document 6,175,087
Multi layer printed circuit board
patent, May 2002
- Swirbel, Thomas J.; Arledge, John K.; Barreto, Joaquin
- US Patent Document 6,388,202
Low-EMI Electronic Apparatus, Low-EMI Circuit Board, and Method of Manufacturing the Low-EMI Circuit Board
patent-application, February 2002
- Akiba, Yutaka; Narizuka, Yasunori; tanei, Hirayoshi
- US Patent Application 09/956909; 20020015293
Lighting Driver and Housing Having Internal Electromagnetic Shielding Layer Configured for Direct Connection to Circuit Ground
patent-application, January 2015
- Aboulnaga, Aly; Miller, Robert Paul
- US Patent Application 14/375453; 20150015152
Metal constrained circuit board side to side interconnection technique
patent, October 1998
- Johannes, William R.; O'Neill, Patrick H.; Mendez, David
- US Patent Document 5,819,401
Printed Circuit Board for Mobile Platforms
patent-application, August 2013
- Chang, Sheng-Ming; Lin, Shih-Chieh; Chen, Nan-Cheng
- US Patent Application 13/747738; 20130220690
Substrate Structure and Manufacturing Method Thereof
patent-application, July 2017
- Yu, Chun-Hsien; Tsai, Hsien-Ming
- US Patent Application 15/392803; 20170208683
Make-before-break ADSL/VDSL Splitter Card
patent-application, January 2006
- Cregan, William J.; Duran, Christian S.
- US Patent Application 10/874940; 20060018462
Self Shielded System in Package (SiP) Modules
patent-application, January 2017
- Lee, Meng Chi; Chauhan, Shakti S.; Carson, Flynn P.
- US Patent Application 14/947353; 20170025361
Light-emitting Device, Print Head and Image Forming Apparatus
patent-application, December 2011
- Okazaki, Sachiya
- US Patent Application
Composite Type LED Circuit Board and Manufacturing Method
patent-application, June 2017
- Yanwei, Shen
- US Patent Application 15/042264; 20170159916
Photoelectric mixed substrate and optical module
patent, April 2015
- Yanagisawa, Kenji
- US Patent Document 9,014,520
Mounting Arrangement for Lighting Devices, Corresponding Lighting Devices and Method
patent-application, August 2011
- Bizzotto, Alessandro; Capeleto, Simone; Hacker, Christian
- US Patent Application 13/124706; 20110199773
Printed Circuit Board for Integrated LED Driver
patent-application, January 2018
- Song, Zhihua; Soer, Wouter; Bonne, Ron
- US Patent Application 15/587567; 20180014373
Connection Member and Mount Assembly and Production Method of the Same
patent-application, August 2005
- Asahi, Toshiyuki; Karashima, Seiji; Ichiryu, Takashi
- US Patent Application 11/060550; 20050184381
Solid interface module
patent, December 2001
- Borkowski, Michael T.; Sikina, Thomas V.; Roman, John W.
- US Patent Document 6,324,755
Illumination system
patent, January 2007
- Thomas, James Gordon; Warner, Bryan T.; McCarthy, Michael
- US Patent Document 7,165,863
High Frequency Module
patent-application, May 2007
- Murata, Tyuji
- US Patent Application 11/589419; 20070103257
Printed circuit board with shielded circuitry
patent, May 2002
- Chua, Ah Lim
- US Patent Document 6,388,205
Field control and stability enhancement in multi-layer, 3-dimensional structures
patent, March 1995
- McClanahan, Robert F.; Washburn, Robert D.
- US Patent Document 5,396,397