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Title: Fine wire manipulator

Abstract

A system for manipulating a filament can include a filament supply from which a filament can be drawn, the filament supply being positioned along an axis, a vacuum manipulator assembly positioned along the axis, wherein the vacuum manipulator assembly is configured to engage the filament when a vacuum is drawn through the vacuum manipulator assembly and draw the filament along the axis to a workpiece, and a welding tool comprising a welding head positioned along the axis between the filament supply and the vacuum manipulator assembly, the welding tool being configured to weld the filament to the workpiece.

Inventors:
Issue Date:
Research Org.:
Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1771565
Patent Number(s):
10818514
Application Number:
16/033,068
Assignee:
Triad National Security, LLC (Los Alamos, NM)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
AC52-06NA25396
Resource Type:
Patent
Resource Relation:
Patent File Date: 07/11/2018
Country of Publication:
United States
Language:
English

Citation Formats

Christensen, Kyle B. Fine wire manipulator. United States: N. p., 2020. Web.
Christensen, Kyle B. Fine wire manipulator. United States.
Christensen, Kyle B. Tue . "Fine wire manipulator". United States. https://www.osti.gov/servlets/purl/1771565.
@article{osti_1771565,
title = {Fine wire manipulator},
author = {Christensen, Kyle B.},
abstractNote = {A system for manipulating a filament can include a filament supply from which a filament can be drawn, the filament supply being positioned along an axis, a vacuum manipulator assembly positioned along the axis, wherein the vacuum manipulator assembly is configured to engage the filament when a vacuum is drawn through the vacuum manipulator assembly and draw the filament along the axis to a workpiece, and a welding tool comprising a welding head positioned along the axis between the filament supply and the vacuum manipulator assembly, the welding tool being configured to weld the filament to the workpiece.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Oct 27 00:00:00 EDT 2020},
month = {Tue Oct 27 00:00:00 EDT 2020}
}

Works referenced in this record:

Method for manufacturing semiconductor device
patent-application, August 2005


Wire bonding apparatus and method
patent, July 1995


Lead frame wire bonding by preheating
patent, February 1984


Wire bonder and wire bonding method
patent, October 1996