Reversibly bonded devices and methods of making and using the same
Abstract
The present disclosure concerns embodiments of reversibly bonded devices that comprise a reversible bonding component. The reversible bonding component is able to exhibit strong adhesive properties so as to couple device components, but upon exposure to an energy source, the strong adhesive properties are weakened. By weakening the adhesive strength of the reversible bonding component, the device can be deconstructed to access internal biological samples for analysis and characterization.
- Inventors:
- Issue Date:
- Research Org.:
- Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1735123
- Patent Number(s):
- 10737261
- Application Number:
- 15/719,187
- Assignee:
- Triad National Security, LLC (Los Alamos, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL B01L - CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
G - PHYSICS G01 - MEASURING G01N - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- DOE Contract Number:
- AC52-06NA25396
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 09/28/2017
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Nath, Pulak, and Huang, Jen-Huang. Reversibly bonded devices and methods of making and using the same. United States: N. p., 2020.
Web.
Nath, Pulak, & Huang, Jen-Huang. Reversibly bonded devices and methods of making and using the same. United States.
Nath, Pulak, and Huang, Jen-Huang. Tue .
"Reversibly bonded devices and methods of making and using the same". United States. https://www.osti.gov/servlets/purl/1735123.
@article{osti_1735123,
title = {Reversibly bonded devices and methods of making and using the same},
author = {Nath, Pulak and Huang, Jen-Huang},
abstractNote = {The present disclosure concerns embodiments of reversibly bonded devices that comprise a reversible bonding component. The reversible bonding component is able to exhibit strong adhesive properties so as to couple device components, but upon exposure to an energy source, the strong adhesive properties are weakened. By weakening the adhesive strength of the reversible bonding component, the device can be deconstructed to access internal biological samples for analysis and characterization.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Aug 11 00:00:00 EDT 2020},
month = {Tue Aug 11 00:00:00 EDT 2020}
}
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