Circuit board interconnect decals
Abstract
A circuit component decal comprising a transparent sheet and an opaque circuit pattern. The transparent sheet includes opposing top and bottom surfaces and a number of edges. The opaque circuit pattern includes an electronic component footprint and a number of circuit lead paths. The electronic component footprint includes a number of contact points representing the location of leads of the electronic component. The circuit lead paths extend from the contact points to the edges of the transparent sheet. The opaque circuit pattern corresponds to only a section of a complete circuit pattern and is configured to block energy from reaching a first portion of the intermediate substrate when the transparent sheet is positioned on the intermediate substrate so as to form the section of the complete circuit pattern.
- Inventors:
- Issue Date:
- Research Org.:
- Kansas City Plant (KCP), Kansas City, MO (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1632422
- Patent Number(s):
- 10531568
- Application Number:
- 16/253,362
- Assignee:
- Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C09 - DYES C09J - ADHESIVES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- NA0000622
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 01/22/2019
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Hatch, Stephen McGarry, and Hatch, Jonathan Douglas. Circuit board interconnect decals. United States: N. p., 2020.
Web.
Hatch, Stephen McGarry, & Hatch, Jonathan Douglas. Circuit board interconnect decals. United States.
Hatch, Stephen McGarry, and Hatch, Jonathan Douglas. Tue .
"Circuit board interconnect decals". United States. https://www.osti.gov/servlets/purl/1632422.
@article{osti_1632422,
title = {Circuit board interconnect decals},
author = {Hatch, Stephen McGarry and Hatch, Jonathan Douglas},
abstractNote = {A circuit component decal comprising a transparent sheet and an opaque circuit pattern. The transparent sheet includes opposing top and bottom surfaces and a number of edges. The opaque circuit pattern includes an electronic component footprint and a number of circuit lead paths. The electronic component footprint includes a number of contact points representing the location of leads of the electronic component. The circuit lead paths extend from the contact points to the edges of the transparent sheet. The opaque circuit pattern corresponds to only a section of a complete circuit pattern and is configured to block energy from reaching a first portion of the intermediate substrate when the transparent sheet is positioned on the intermediate substrate so as to form the section of the complete circuit pattern.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jan 07 00:00:00 EST 2020},
month = {Tue Jan 07 00:00:00 EST 2020}
}
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