Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate
Abstract
The present invention generally provides semiconductor substrates having submicron-sized surface features generated by irradiating the surface with ultra short laser pulses. In one aspect, a method of processing a semiconductor substrate is disclosed that includes placing at least a portion of a surface of the substrate in contact with a fluid, and exposing that surface portion to one or more femtosecond pulses so as to modify the topography of that portion. The modification can include, e.g., generating a plurality of submicron-sized spikes in an upper layer of the surface.
- Inventors:
- Issue Date:
- Research Org.:
- Harvard Univ., Cambridge, MA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1568634
- Patent Number(s):
- 10361083
- Application Number:
- 14/836,609
- Assignee:
- President and Fellows of Harvard College (Cambridge, MA)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- FG36-01GO11053
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 08/26/2015
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Mazur, Eric, and Shen, Mengyan. Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate. United States: N. p., 2019.
Web.
Mazur, Eric, & Shen, Mengyan. Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate. United States.
Mazur, Eric, and Shen, Mengyan. Tue .
"Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate". United States. https://www.osti.gov/servlets/purl/1568634.
@article{osti_1568634,
title = {Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate},
author = {Mazur, Eric and Shen, Mengyan},
abstractNote = {The present invention generally provides semiconductor substrates having submicron-sized surface features generated by irradiating the surface with ultra short laser pulses. In one aspect, a method of processing a semiconductor substrate is disclosed that includes placing at least a portion of a surface of the substrate in contact with a fluid, and exposing that surface portion to one or more femtosecond pulses so as to modify the topography of that portion. The modification can include, e.g., generating a plurality of submicron-sized spikes in an upper layer of the surface.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jul 23 00:00:00 EDT 2019},
month = {Tue Jul 23 00:00:00 EDT 2019}
}
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