Solder assembly of pins to the peripheral end face of a printed circuit board
Abstract
A printed circuit board (PCB) and PCB assembly. The PCB is formed of a laminate substrate of at least two layers of a non-conductive material forming at least one peripheral end face (PEF) surface separating top and bottom PCB surfaces. Embedded conductive wiring at one or more multiple layers carry energy to or from PCB surface mounted devices. The conductive wiring provides multiple conductive wire ends exposed at multiple locations along the PEF. A conductive contact structure is formed at the PEF surface to connect with one or more of the exposed conductive wire ends. One or more conductive pins are attached to the conductive contact at the PEF and are configured to mount the PCB on, and in a vertical and perpendicular orientation or a coplanar orientation relative to, a surface of a second PCB surface. The conductive pins provide one or more of: an electrical, thermal and/or mechanical contact.
- Inventors:
- Issue Date:
- Research Org.:
- International Business Machines Corp., Armonk, NY (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1568469
- Patent Number(s):
- 10321564
- Application Number:
- 15/808,786
- Assignee:
- International Business Machines Corporation (Armonk, NY)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- B621073
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 11/09/2017
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Takken, Todd E., Zhang, Xin, Yao, Yuan, and Ferencz, Andrew. Solder assembly of pins to the peripheral end face of a printed circuit board. United States: N. p., 2019.
Web.
Takken, Todd E., Zhang, Xin, Yao, Yuan, & Ferencz, Andrew. Solder assembly of pins to the peripheral end face of a printed circuit board. United States.
Takken, Todd E., Zhang, Xin, Yao, Yuan, and Ferencz, Andrew. Tue .
"Solder assembly of pins to the peripheral end face of a printed circuit board". United States. https://www.osti.gov/servlets/purl/1568469.
@article{osti_1568469,
title = {Solder assembly of pins to the peripheral end face of a printed circuit board},
author = {Takken, Todd E. and Zhang, Xin and Yao, Yuan and Ferencz, Andrew},
abstractNote = {A printed circuit board (PCB) and PCB assembly. The PCB is formed of a laminate substrate of at least two layers of a non-conductive material forming at least one peripheral end face (PEF) surface separating top and bottom PCB surfaces. Embedded conductive wiring at one or more multiple layers carry energy to or from PCB surface mounted devices. The conductive wiring provides multiple conductive wire ends exposed at multiple locations along the PEF. A conductive contact structure is formed at the PEF surface to connect with one or more of the exposed conductive wire ends. One or more conductive pins are attached to the conductive contact at the PEF and are configured to mount the PCB on, and in a vertical and perpendicular orientation or a coplanar orientation relative to, a surface of a second PCB surface. The conductive pins provide one or more of: an electrical, thermal and/or mechanical contact.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jun 11 00:00:00 EDT 2019},
month = {Tue Jun 11 00:00:00 EDT 2019}
}
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