High temperature vibration resistant solderless electrical connections for planar surfaces
Abstract
An electrical arrangement (10), including: a first conductor (12) having a first generally planar contact area (34); a second conductor (12) having a second generally planar contact area (40); an intermediate conductor (44) having a first faying area (84) overlying the first contact area and a second faying area (86) overlying the second contact area; a compression arrangement configured to compress the first faying area and the first contact area toward each other and to compress the second faying area and the second contact area toward each other; and a dimpling structure (46) effective to create plural contact points (74) between the first faying area and the first contact area and between the second faying area and the second contact area when the first and the second faying areas and the first and second contact areas are compressed toward each other by the compression arrangement.
- Inventors:
- Issue Date:
- Research Org.:
- Siemens Energy, Inc., Orlando, FL (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1531358
- Patent Number(s):
- 10050356
- Application Number:
- 14/576,365
- Assignee:
- Siemens Energy, Inc. (Orlando, FL)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01R - ELECTRICALLY-CONDUCTIVE CONNECTIONS
- DOE Contract Number:
- FE0005666
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2014-12-19
- Country of Publication:
- United States
- Language:
- English
Citation Formats
McConkey, Joshua S. High temperature vibration resistant solderless electrical connections for planar surfaces. United States: N. p., 2018.
Web.
McConkey, Joshua S. High temperature vibration resistant solderless electrical connections for planar surfaces. United States.
McConkey, Joshua S. Tue .
"High temperature vibration resistant solderless electrical connections for planar surfaces". United States. https://www.osti.gov/servlets/purl/1531358.
@article{osti_1531358,
title = {High temperature vibration resistant solderless electrical connections for planar surfaces},
author = {McConkey, Joshua S.},
abstractNote = {An electrical arrangement (10), including: a first conductor (12) having a first generally planar contact area (34); a second conductor (12) having a second generally planar contact area (40); an intermediate conductor (44) having a first faying area (84) overlying the first contact area and a second faying area (86) overlying the second contact area; a compression arrangement configured to compress the first faying area and the first contact area toward each other and to compress the second faying area and the second contact area toward each other; and a dimpling structure (46) effective to create plural contact points (74) between the first faying area and the first contact area and between the second faying area and the second contact area when the first and the second faying areas and the first and second contact areas are compressed toward each other by the compression arrangement.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Aug 14 00:00:00 EDT 2018},
month = {Tue Aug 14 00:00:00 EDT 2018}
}
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