Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader
Abstract
Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.
- Inventors:
- Issue Date:
- Research Org.:
- International Business Machines Corp., Armonk, NY (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1467426
- Patent Number(s):
- 10045463
- Application Number:
- 14/562,867
- Assignee:
- International Business Machines Corporation (Armonk, NY)
- Patent Classifications (CPCs):
-
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- EE0002894
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2014 Dec 08
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Chainer, Timothy J., Graybill, David P., Iyengar, Madhusudan K., Kamath, Vinod, Kochuparambil, Bejoy J., Schmidt, Roger R., and Steinke, Mark E. Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader. United States: N. p., 2018.
Web.
Chainer, Timothy J., Graybill, David P., Iyengar, Madhusudan K., Kamath, Vinod, Kochuparambil, Bejoy J., Schmidt, Roger R., & Steinke, Mark E. Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader. United States.
Chainer, Timothy J., Graybill, David P., Iyengar, Madhusudan K., Kamath, Vinod, Kochuparambil, Bejoy J., Schmidt, Roger R., and Steinke, Mark E. Tue .
"Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader". United States. https://www.osti.gov/servlets/purl/1467426.
@article{osti_1467426,
title = {Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader},
author = {Chainer, Timothy J. and Graybill, David P. and Iyengar, Madhusudan K. and Kamath, Vinod and Kochuparambil, Bejoy J. and Schmidt, Roger R. and Steinke, Mark E.},
abstractNote = {Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Aug 07 00:00:00 EDT 2018},
month = {Tue Aug 07 00:00:00 EDT 2018}
}
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Hybrid Air And Liquid Coolant Conditioning Unit For Facilitating Cooling Of One Or More Electronics Racks Of A Data Center
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Airflow Recirculation and Cooling Apparatus and Method for an Electronics Rack
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Computer Rack Cooling Using Independently-Controlled Flow of Coolants Through A Dual-Section Heat Exchanger
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Cooling Memory Modules Using Cold Plate Blades Coupled to the Memory Modules via Chips
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Cooled Electronic System With Liquid-Cooled Cold Plate And Thermal Spreader Coupled To Electronic Component
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Cooled Electronic System with Thermal Spreaders Coupling Electronics Cards to Cold Rails
patent-application, November 2012
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Mechanically-Reattachable Liquid-Cooled Cooling Apparatus
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Liquid-Cooling Memory Modules with Liquid Flow Pipes Between Memory Module Sockets
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Dynamically Limiting Energy Consumed by Cooling Apparatus
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Directly Connected Heat Exchanger Tube Section and Coolant-Cooled Structure
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Liquid-Cooled Memory System having One Cooling Pipe Per Pair of DIMMS
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Method, Apparatus, and System for Dissipating Heat of Memory with Liquid Cooling
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Thermal Transfer Structures Coupling Electronics Card(s) to Coolant-Cooled Structure(s)
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Cooled Electronic System With Liquid-Cooled Cold Plate and Thermal Spreader Coupled to Electronic Componenet
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Cooled Electronic System with Liquid-Cooled Cold Plate and Thermal Spreader Coupled to Electronic Component
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Sectioned Manifolds Facilitating Pumped Immersion-Cooling Of Electronic Components
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Thermoelectric-Enhanced Air and Liquid Cooling of an Electronic System
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