Laser-induced gas plasma machining
Abstract
Techniques for removing material from a substrate are provided. A laser beam is focused at a distance from the surface to be treated. A gas is provided at the focus point. The gas is dissociated using the laser energy to generate gas plasma. The substrate is then brought in contact with the gas plasma to enable material removal.
- Inventors:
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1400251
- Patent Number(s):
- 9790090
- Application Number:
- 13/797,495
- Assignee:
- Lawrence Livermore National Security, LLC
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- DOE Contract Number:
- AC52-07NA27344
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2013 Mar 12
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Elhadj, Selim, Bass, Isaac Louis, Guss, Gabriel Mark, and Matthews, Manyalibo J. Laser-induced gas plasma machining. United States: N. p., 2017.
Web.
Elhadj, Selim, Bass, Isaac Louis, Guss, Gabriel Mark, & Matthews, Manyalibo J. Laser-induced gas plasma machining. United States.
Elhadj, Selim, Bass, Isaac Louis, Guss, Gabriel Mark, and Matthews, Manyalibo J. Tue .
"Laser-induced gas plasma machining". United States. https://www.osti.gov/servlets/purl/1400251.
@article{osti_1400251,
title = {Laser-induced gas plasma machining},
author = {Elhadj, Selim and Bass, Isaac Louis and Guss, Gabriel Mark and Matthews, Manyalibo J.},
abstractNote = {Techniques for removing material from a substrate are provided. A laser beam is focused at a distance from the surface to be treated. A gas is provided at the focus point. The gas is dissociated using the laser energy to generate gas plasma. The substrate is then brought in contact with the gas plasma to enable material removal.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Oct 17 00:00:00 EDT 2017},
month = {Tue Oct 17 00:00:00 EDT 2017}
}
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