LED module with high index lens

Bierhuizen, Serge J.; Wang, Nanze Patrick; Eng, Gregory W.; Sun, Decai; Wei, Yajun

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A - human necessities
A01 - agriculture
A21 - baking
A22 - butchering
A23 - foods or foodstuffs
A24 - tobacco
A41 - wearing apparel
A42 - headwear
A43 - footwear
A44 - haberdashery
A45 - hand or travelling articles
A46 - brushware
A47 - furniture
A61 - medical or veterinary science
A62 - life-saving
A63 - sports
A99 - subject matter not otherwise provided for in this section
B - performing operations
B01 - physical or chemical processes or apparatus in general
B02 - crushing, pulverising, or disintegrating
B03 - separation of solid materials using liquids or using pneumatic tables or jigs
B04 - centrifugal apparatus or machines for carrying-out physical or chemical processes
B05 - spraying or atomising in general
B06 - generating or transmitting mechanical vibrations in general
B07 - separating solids from solids
B08 - cleaning
B09 - disposal of solid waste
B21 - mechanical metal-working without essentially removing material
B22 - casting
B23 - machine tools
B24 - grinding
B25 - hand tools
B26 - hand cutting tools
B27 - working or preserving wood or similar material
B28 - working cement, clay, or stone
B29 - working of plastics
B30 - presses
B31 - making articles of paper, cardboard or material worked in a manner analogous to paper
B32 - layered products
B33 - additive manufacturing technology
B41 - printing
B42 - bookbinding
B43 - writing or drawing implements
B44 - decorative arts
B60 - vehicles in general
B61 - railways
B62 - land vehicles for travelling otherwise than on rails
B63 - ships or other waterborne vessels
B64 - aircraft
B65 - conveying
B66 - hoisting
B67 - opening, closing {or cleaning} bottles, jars or similar containers
B68 - saddlery
B81 - microstructural technology
B82 - nanotechnology
B99 - subject matter not otherwise provided for in this section
C - chemistry
C01 - inorganic chemistry
C02 - treatment of water, waste water, sewage, or sludge
C03 - glass
C04 - cements
C05 - fertilisers
C06 - explosives
C07 - organic chemistry
C08 - organic macromolecular compounds
C09 - dyes
C10 - petroleum, gas or coke industries
C11 - animal or vegetable oils, fats, fatty substances or waxes
C12 - biochemistry
C13 - sugar industry
C14 - skins
C21 - metallurgy of iron
C22 - metallurgy
C23 - coating metallic material
C25 - electrolytic or electrophoretic processes
C30 - crystal growth
C40 - combinatorial technology
C99 - subject matter not otherwise provided for in this section
D - textiles
D01 - natural or man-made threads or fibres
D02 - yarns
D03 - weaving
D04 - braiding
D05 - sewing
D06 - treatment of textiles or the like
D07 - ropes
D10 - indexing scheme associated with sublasses of section d, relating to textiles
D21 - paper-making
D99 - subject matter not otherwise provided for in this section
E - fixed constructions
E01 - construction of roads, railways, or bridges
E02 - hydraulic engineering
E03 - water supply
E04 - building
E05 - locks
E06 - doors, windows, shutters, or roller blinds in general
E21 - earth drilling
E99 - subject matter not otherwise provided for in this section
F - mechanical engineering
F01 - machines or engines in general
F02 - combustion engines
F03 - machines or engines for liquids
F04 - positive - displacement machines for liquids
F05 - indexing schemes relating to engines or pumps in various subclasses of classes f01-f04
F15 - fluid-pressure actuators
F16 - engineering elements and units
F17 - storing or distributing gases or liquids
F21 - lighting
F22 - steam generation
F23 - combustion apparatus
F24 - heating
F25 - refrigeration or cooling
F26 - drying
F27 - furnaces
F28 - heat exchange in general
F41 - weapons
F42 - ammunition
F99 - subject matter not otherwise provided for in this section
G - physics
G01 - measuring
G02 - optics
G03 - photography
G04 - horology
G05 - controlling
G06 - computing
G07 - checking-devices
G08 - signalling
G09 - education
G10 - musical instruments
G11 - information storage
G12 - instrument details
G16 - information and communication technology [ict] specially adapted for specific application fields
G21 - nuclear physics
G99 - subject matter not otherwise provided for in this section
H - electricity
H01 - basic electric elements
H02 - generation
H03 - basic electronic circuitry
H04 - electric communication technique
H05 - electric techniques not otherwise provided for
H99 - subject matter not otherwise provided for in this section
Y - new / cross sectional technologies
Y02 - technologies or applications for mitigation or adaptation against climate change
Y04 - information or communication technologies having an impact on other technology areas
Y10 - technical subjects covered by former uspc

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Title: LED module with high index lens

Abstract

An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules.

Inventors:: Bierhuizen, Serge J.; Wang, Nanze Patrick; Eng, Gregory W.; Sun, Decai; Wei, Yajun

Issue Date:: Tue Jul 05 00:00:00 EDT 2016

Research Org.:: LUMILEDS LLC, San Jose, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1260215

Patent Number(s):: 9385285

Application Number:: 12/561,617

Assignee:: LUMILEDS LLC (San Jose, CA)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L25/13 - the devices being of a type provided for in group H01L33/00
H01L25/50 - {Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L2933/0033 - relating to semiconductor body packages
H01L2933/0041 - relating to wavelength conversion elements
H01L2933/0058 - relating to optical field-shaping elements
H01L2933/0066 - relating to arrangements for conducting electric current to or from the semiconductor body
H01L2933/0091 - Scattering means in or on the semiconductor body or semiconductor body package
H01L33/486 - {adapted for surface mounting}
H01L33/507 - {the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body}
H01L33/58 - Optical field-shaping elements
H01L33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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DOE Contract Number:: FC26-08NT01583

Resource Type:: Patent

Resource Relation:: Patent File Date: 2009 Sep 17

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE

Citation Formats


                    Bierhuizen, Serge J., Wang, Nanze Patrick, Eng, Gregory W., Sun, Decai, and Wei, Yajun. LED module with high index lens.  United States: N. p., 2016. 
        Web.

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                    Bierhuizen, Serge J., Wang, Nanze Patrick, Eng, Gregory W., Sun, Decai, & Wei, Yajun. LED module with high index lens.  United States.

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                    Bierhuizen, Serge J., Wang, Nanze Patrick, Eng, Gregory W., Sun, Decai, and Wei, Yajun. Tue .  
        "LED module with high index lens".  United States.  https://www.osti.gov/servlets/purl/1260215.

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@article{osti_1260215,

  title        = {LED module with high index lens},

  author       = {Bierhuizen, Serge J. and Wang, Nanze Patrick and Eng, Gregory W. and Sun, Decai and Wei, Yajun},

  abstractNote = {An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {Tue Jul 05 00:00:00 EDT 2016},

  month        = {Tue Jul 05 00:00:00 EDT 2016}

}

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Light source device using led, and method of producing same
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Semiconductor light-emitting device
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Morita, Yasumasa; Oba, Hayato; Fujisawa, Shigeo
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Composite heat conductive structure for a LED package
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Lighting Device Package
patent-application, March 2008

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Molded Lens Incorporating a Window Element
patent-application, March 2011

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Title: LED module with high index lens

Abstract

Citation Formats

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LED package having an array of light emitting cells coupled in series patent, December 2013

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Semiconductor light-emitting device patent-application, March 2005

Composite heat conductive structure for a LED package patent-application, March 2006

Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same patent-application, July 2006

LED housing and fabrication method thereof patent-application, August 2006

Light emitting device patent-application, April 2007

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Lighting Device Package patent-application, March 2008

Method of Making a Light Emitting Device Having a Molded Encapsulant patent-application, April 2008

Package structure with replaceable element for light emitting diode patent-application, March 2009

Molded Lens Incorporating a Window Element patent-application, March 2011

Image devices
patent, August 1995

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patent, December 2013

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