LED module with high index lens
Abstract
An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules.
- Inventors:
- Issue Date:
- Research Org.:
- LUMILEDS LLC, San Jose, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1260215
- Patent Number(s):
- 9385285
- Application Number:
- 12/561,617
- Assignee:
- LUMILEDS LLC (San Jose, CA)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- FC26-08NT01583
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2009 Sep 17
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Bierhuizen, Serge J., Wang, Nanze Patrick, Eng, Gregory W., Sun, Decai, and Wei, Yajun. LED module with high index lens. United States: N. p., 2016.
Web.
Bierhuizen, Serge J., Wang, Nanze Patrick, Eng, Gregory W., Sun, Decai, & Wei, Yajun. LED module with high index lens. United States.
Bierhuizen, Serge J., Wang, Nanze Patrick, Eng, Gregory W., Sun, Decai, and Wei, Yajun. Tue .
"LED module with high index lens". United States. https://www.osti.gov/servlets/purl/1260215.
@article{osti_1260215,
title = {LED module with high index lens},
author = {Bierhuizen, Serge J. and Wang, Nanze Patrick and Eng, Gregory W. and Sun, Decai and Wei, Yajun},
abstractNote = {An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jul 05 00:00:00 EDT 2016},
month = {Tue Jul 05 00:00:00 EDT 2016}
}
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