Environmentally-assisted technique for transferring devices onto non-conventional substrates
Abstract
A device fabrication method includes: (1) providing a growth substrate including an oxide layer; (2) forming a metal layer over the oxide layer; (3) forming a stack of device layers over the metal layer; (4) performing fluid-assisted interfacial debonding of the metal layer to separate the stack of device layers and the metal layer from the growth substrate; and (5) affixing the stack of device layers to a target substrate.
- Inventors:
- Issue Date:
- Research Org.:
- Stanford Univ., CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1252201
- Patent Number(s):
- 9337169
- Application Number:
- 14/340,425
- Assignee:
- The Board of Trustees of the Leland Stanford Junior University (Palo Alto, CA)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- DOE Contract Number:
- SC0001060
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2014 Jul 24
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Lee, Chi-Hwan, Kim, Dong Rip, and Zheng, Xiaolin. Environmentally-assisted technique for transferring devices onto non-conventional substrates. United States: N. p., 2016.
Web.
Lee, Chi-Hwan, Kim, Dong Rip, & Zheng, Xiaolin. Environmentally-assisted technique for transferring devices onto non-conventional substrates. United States.
Lee, Chi-Hwan, Kim, Dong Rip, and Zheng, Xiaolin. Tue .
"Environmentally-assisted technique for transferring devices onto non-conventional substrates". United States. https://www.osti.gov/servlets/purl/1252201.
@article{osti_1252201,
title = {Environmentally-assisted technique for transferring devices onto non-conventional substrates},
author = {Lee, Chi-Hwan and Kim, Dong Rip and Zheng, Xiaolin},
abstractNote = {A device fabrication method includes: (1) providing a growth substrate including an oxide layer; (2) forming a metal layer over the oxide layer; (3) forming a stack of device layers over the metal layer; (4) performing fluid-assisted interfacial debonding of the metal layer to separate the stack of device layers and the metal layer from the growth substrate; and (5) affixing the stack of device layers to a target substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue May 10 00:00:00 EDT 2016},
month = {Tue May 10 00:00:00 EDT 2016}
}
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