Fully integrated and encapsulated micro-fabricated vacuum diode and method of manufacturing same
Abstract
Disclosed is an encapsulated micro-diode and a method for producing same. The method comprises forming a plurality columns in the substrate with a respective tip disposed at a first end of the column, the tip defining a cathode of the diode; disposing a sacrificial oxide layer on the substrate, plurality of columns and respective tips; forming respective trenches in the sacrificial oxide layer around the columns; forming an opening in the sacrificial oxide layer to expose a portion of the tips; depositing a conductive material in of the opening and on a surface of the substrate to form an anode of the diode; and removing the sacrificial oxide layer.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1227357
- Patent Number(s):
- 9202657
- Application Number:
- 14/340,012
- Assignee:
- Sandia Corporation
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01J - ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2014 Jul 24
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY
Citation Formats
Resnick, Paul J., and Langlois, Eric. Fully integrated and encapsulated micro-fabricated vacuum diode and method of manufacturing same. United States: N. p., 2015.
Web.
Resnick, Paul J., & Langlois, Eric. Fully integrated and encapsulated micro-fabricated vacuum diode and method of manufacturing same. United States.
Resnick, Paul J., and Langlois, Eric. Tue .
"Fully integrated and encapsulated micro-fabricated vacuum diode and method of manufacturing same". United States. https://www.osti.gov/servlets/purl/1227357.
@article{osti_1227357,
title = {Fully integrated and encapsulated micro-fabricated vacuum diode and method of manufacturing same},
author = {Resnick, Paul J. and Langlois, Eric},
abstractNote = {Disclosed is an encapsulated micro-diode and a method for producing same. The method comprises forming a plurality columns in the substrate with a respective tip disposed at a first end of the column, the tip defining a cathode of the diode; disposing a sacrificial oxide layer on the substrate, plurality of columns and respective tips; forming respective trenches in the sacrificial oxide layer around the columns; forming an opening in the sacrificial oxide layer to expose a portion of the tips; depositing a conductive material in of the opening and on a surface of the substrate to form an anode of the diode; and removing the sacrificial oxide layer.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Dec 01 00:00:00 EST 2015},
month = {Tue Dec 01 00:00:00 EST 2015}
}
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