Apparatus for the compact cooling of modules
Abstract
An apparatus for the compact cooling of modules. The apparatus includes a clip, a first cover plate coupled to a first side of the clip, a second cover plate coupled to a second side of the clip opposite to the first side of the clip, a first frame thermally coupled to the first cover plate, and a second frame thermally coupled to the second cover plate. Each of the first frame and the second frame may include a plurality of channels for passing coolant through the first frame and the second frame, respectively. Additionally, the apparatus may further include a filler for directing coolant through the plurality of channels, and for blocking coolant from flowing along the first side of the clip and the second side of the clip.
- Inventors:
- Issue Date:
- Research Org.:
- International Business Machines Corp., Armonk, NY (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1190908
- Patent Number(s):
- 9076753
- Application Number:
- 13/475,348
- Assignee:
- International Business Machines Corporation (Armonk, NY)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- EE0002894
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2012 May 18
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING; 97 MATHEMATICS AND COMPUTING
Citation Formats
Iyengar, Madhusudan K., and Parida, Pritish R. Apparatus for the compact cooling of modules. United States: N. p., 2015.
Web.
Iyengar, Madhusudan K., & Parida, Pritish R. Apparatus for the compact cooling of modules. United States.
Iyengar, Madhusudan K., and Parida, Pritish R. Tue .
"Apparatus for the compact cooling of modules". United States. https://www.osti.gov/servlets/purl/1190908.
@article{osti_1190908,
title = {Apparatus for the compact cooling of modules},
author = {Iyengar, Madhusudan K. and Parida, Pritish R.},
abstractNote = {An apparatus for the compact cooling of modules. The apparatus includes a clip, a first cover plate coupled to a first side of the clip, a second cover plate coupled to a second side of the clip opposite to the first side of the clip, a first frame thermally coupled to the first cover plate, and a second frame thermally coupled to the second cover plate. Each of the first frame and the second frame may include a plurality of channels for passing coolant through the first frame and the second frame, respectively. Additionally, the apparatus may further include a filler for directing coolant through the plurality of channels, and for blocking coolant from flowing along the first side of the clip and the second side of the clip.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jul 07 00:00:00 EDT 2015},
month = {Tue Jul 07 00:00:00 EDT 2015}
}
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