Localized temperature stability of low temperature cofired ceramics
Abstract
The present invention is directed to low temperature cofired ceramic modules having localized temperature stability by incorporating temperature coefficient of resonant frequency compensating materials locally into a multilayer LTCC module. Chemical interactions can be minimized and physical compatibility between the compensating materials and the host LTCC dielectrics can be achieved. The invention enables embedded resonators with nearly temperature-independent resonance frequency.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1109085
- Patent Number(s):
- 8593237
- Application Number:
- 13/245,535
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01P - WAVEGUIDES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Dai, Steven Xunhu. Localized temperature stability of low temperature cofired ceramics. United States: N. p., 2013.
Web.
Dai, Steven Xunhu. Localized temperature stability of low temperature cofired ceramics. United States.
Dai, Steven Xunhu. Tue .
"Localized temperature stability of low temperature cofired ceramics". United States. https://www.osti.gov/servlets/purl/1109085.
@article{osti_1109085,
title = {Localized temperature stability of low temperature cofired ceramics},
author = {Dai, Steven Xunhu},
abstractNote = {The present invention is directed to low temperature cofired ceramic modules having localized temperature stability by incorporating temperature coefficient of resonant frequency compensating materials locally into a multilayer LTCC module. Chemical interactions can be minimized and physical compatibility between the compensating materials and the host LTCC dielectrics can be achieved. The invention enables embedded resonators with nearly temperature-independent resonance frequency.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 26 00:00:00 EST 2013},
month = {Tue Nov 26 00:00:00 EST 2013}
}
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