Printed circuit board impedance matching step for microwave (millimeter wave) devices
Abstract
An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices. A method of constructing microwave and other high frequency electrical circuits on a substrate of uniform thickness, where the circuit is formed of a plurality of interconnected elements of different impedances that individually require substrates of different thicknesses, by providing a substrate of uniform thickness that is a composite or multilayered substrate; and forming a pattern of intermediate ground planes or impedance matching steps interconnected by vias located under various parts of the circuit where components of different impedances are located so that each part of the circuit has a ground plane substrate thickness that is optimum while the entire circuit is formed on a substrate of uniform thickness.
- Inventors:
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1107573
- Patent Number(s):
- 8547187
- Application Number:
- 12/895,347
- Assignee:
- Lawrence Livermore National Security, LLC. (Livermore, CA); Kyocera America, Inc. (San Diego, CA)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01R - ELECTRICALLY-CONDUCTIVE CONNECTIONS
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- AC52-07NA27344
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Pao, Hsueh-Yuan, Aguirre, Jerardo, and Sargis, Paul. Printed circuit board impedance matching step for microwave (millimeter wave) devices. United States: N. p., 2013.
Web.
Pao, Hsueh-Yuan, Aguirre, Jerardo, & Sargis, Paul. Printed circuit board impedance matching step for microwave (millimeter wave) devices. United States.
Pao, Hsueh-Yuan, Aguirre, Jerardo, and Sargis, Paul. Tue .
"Printed circuit board impedance matching step for microwave (millimeter wave) devices". United States. https://www.osti.gov/servlets/purl/1107573.
@article{osti_1107573,
title = {Printed circuit board impedance matching step for microwave (millimeter wave) devices},
author = {Pao, Hsueh-Yuan and Aguirre, Jerardo and Sargis, Paul},
abstractNote = {An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices. A method of constructing microwave and other high frequency electrical circuits on a substrate of uniform thickness, where the circuit is formed of a plurality of interconnected elements of different impedances that individually require substrates of different thicknesses, by providing a substrate of uniform thickness that is a composite or multilayered substrate; and forming a pattern of intermediate ground planes or impedance matching steps interconnected by vias located under various parts of the circuit where components of different impedances are located so that each part of the circuit has a ground plane substrate thickness that is optimum while the entire circuit is formed on a substrate of uniform thickness.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Oct 01 00:00:00 EDT 2013},
month = {Tue Oct 01 00:00:00 EDT 2013}
}
Works referenced in this record:
Microstrip patch antenna with fractal structure
patent, October 2000
- Cohen, Nathan
- US Patent Document 6,127,977
Constant impedance transition between transmission structures of different dimensions
patent, February 1993
- Hanz, Curtis L.; Gulick, Jon J.; Virga, Kathleen L.
- US Patent Document 5,184,095