Integrated three-dimensional module heat exchanger for power electronics cooling
Abstract
Embodiments discussed herein are directed to a power semiconductor packaging that removes heat from a semiconductor package through one or more cooling zones that are located in a laterally oriented position with respect to the semiconductor package. Additional embodiments are directed to circuit elements that are constructed from one or more modular power semiconductor packages.
- Inventors:
- Issue Date:
- Research Org.:
- National Renewable Energy Laboratory (NREL), Golden, CO (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1096006
- Patent Number(s):
- 8541875
- Application Number:
- 13/249,706
- Assignee:
- Alliance for Sustainable Energy, LLC (Golden, CO)
- Patent Classifications (CPCs):
-
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC36-08GO28308
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Bennion, Kevin, and Lustbader, Jason. Integrated three-dimensional module heat exchanger for power electronics cooling. United States: N. p., 2013.
Web.
Bennion, Kevin, & Lustbader, Jason. Integrated three-dimensional module heat exchanger for power electronics cooling. United States.
Bennion, Kevin, and Lustbader, Jason. Tue .
"Integrated three-dimensional module heat exchanger for power electronics cooling". United States. https://www.osti.gov/servlets/purl/1096006.
@article{osti_1096006,
title = {Integrated three-dimensional module heat exchanger for power electronics cooling},
author = {Bennion, Kevin and Lustbader, Jason},
abstractNote = {Embodiments discussed herein are directed to a power semiconductor packaging that removes heat from a semiconductor package through one or more cooling zones that are located in a laterally oriented position with respect to the semiconductor package. Additional embodiments are directed to circuit elements that are constructed from one or more modular power semiconductor packages.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Sep 24 00:00:00 EDT 2013},
month = {Tue Sep 24 00:00:00 EDT 2013}
}
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Works referenced in this record:
Compliant thermal interface devices and method of making the devices
patent, June 2002
- Bedard, Jacques
- US Patent Document 6,411,513
Semiconductor die package including stacked dice and heat sink structures
patent, July 2009
- Lee, Sangdo; Maldo, Tiburcio A.
- US Patent Document 7,564,124
High performance large tolerance heat sink
patent, August 2011
- Dando, III, Charles H.; Larcheveque, Jon; Vos, David L.
- US Patent Document 7,995,344
Condenser for power module and power module
patent, November 2010
- Baba, Youichiro; Nakamura, Hideo
- US Patent Document 7,839,641
Stack module
patent, March 1999
- Tokuno, Kenichi; Morisaki, Ikushi; Doya, Akihiro
- US Patent Document 5,883,426
Apparatus for cooling semiconductor devices attached to a printed circuit board
patent, March 2007
- Schmidberger, Stefan
- US Patent Document 7,187,553
Connecting device for contacting a semiconductor component
patent, August 2009
- Hauenstein, Henning M.; Balszunat, Dirk
- US Patent Document 7,573,727
Semiconductor integrated circuit chip packages having integrated microchannel cooling modules
patent, June 2007
- Andry, Paul S.; Colgan, Evan G.; Mok, Lawrence S.
- US Patent Document 7,230,334
Package with improved heat transfer structure for semiconductor device
patent, June 1996
- Takahashi, Nobuaki
- US Patent Document 5,528,456
Electronic module having a multi-layer conductor for reducing its resistivity and a method of assembling such a module
patent, October 2011
- Morelle, Jean-Michel; Vivet, Laurent; Medina, Mathieu
- US Patent Document 8,039,973