Rapid thermal processing by stamping

Stradins, Pauls; Wang, Qi

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A - human necessities
A01 - agriculture
A21 - baking
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Title: Rapid thermal processing by stamping

Abstract

A rapid thermal processing device and methods are provided for thermal processing of samples such as semiconductor wafers. The device has components including a stamp (35) having a stamping surface and a heater or cooler (40) to bring it to a selected processing temperature, a sample holder (20) for holding a sample (10) in position for intimate contact with the stamping surface; and positioning components (25) for moving the stamping surface and the stamp (35) in and away from intimate, substantially non-pressured contact. Methods for using and making such devices are also provided. These devices and methods allow inexpensive, efficient, easily controllable thermal processing.

Inventors:: Stradins, Pauls; Wang, Qi

Issue Date:: Tue Mar 05 00:00:00 EST 2013

Research Org.:: National Renewable Energy Laboratory (NREL), Golden, CO (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1083459

Patent Number(s):: 8389422

Application Number:: 12/675,117

Assignee:: Alliance for Sustainable Energy, LLC (Golden, CO)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L21/324 - Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
H01L21/67103 - {mainly by conduction}

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/49826 - Assembling or joining

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DOE Contract Number:: AC36-99G010337

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: 75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; 42 ENGINEERING

Citation Formats


                    Stradins, Pauls, and Wang, Qi. Rapid thermal processing by stamping.  United States: N. p., 2013. 
        Web.

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                    Stradins, Pauls, & Wang, Qi. Rapid thermal processing by stamping.  United States.

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                    Stradins, Pauls, and Wang, Qi. Tue .  
        "Rapid thermal processing by stamping".  United States.  https://www.osti.gov/servlets/purl/1083459.

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@article{osti_1083459,

  title        = {Rapid thermal processing by stamping},

  author       = {Stradins, Pauls and Wang, Qi},

  abstractNote = {A rapid thermal processing device and methods are provided for thermal processing of samples such as semiconductor wafers. The device has components including a stamp (35) having a stamping surface and a heater or cooler (40) to bring it to a selected processing temperature, a sample holder (20) for holding a sample (10) in position for intimate contact with the stamping surface; and positioning components (25) for moving the stamping surface and the stamp (35) in and away from intimate, substantially non-pressured contact. Methods for using and making such devices are also provided. These devices and methods allow inexpensive, efficient, easily controllable thermal processing.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {Tue Mar 05 00:00:00 EST 2013},

  month        = {Tue Mar 05 00:00:00 EST 2013}

}

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Works referenced in this record:

Speaker adapted to corner-loaded installation
patent, February 1986

Prophit, David A.
US Patent Document 4,567,959
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/4567959

Solution deposition of chalcogenide films
patent, April 2005

Mitzi, David B.
US Patent Document 6,875,661
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6875661

Method for forming polycrystalline silicon from the crystallization of microcrystalline silicon
patent, October 1998

Voutsas, Tolis
US Patent Document 5,827,773
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/5827773

Solid phase crystallization of thin films of Si prepared by plasma‐enhanced chemical vapor deposition
journal, July 1993

Masaki, Y.; LeComber, P. G.; Fitzgerald, A. G.
Journal of Applied Physics, Vol. 74, Issue 1
https://doi.org/10.1063/1.354144

Method for heating and cooling substrates
patent, December 2003

Morad, Ratson; Shin, Ho Seon; Cheung, Robin
US Patent Document 6,658,763
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6658763

Light management film with colorant receiving layer
patent, November 2004

Bourdelais, Robert P.; Kaminsky, Cheryl J.; Arrington, Eric E.
US Patent Document 6,818,276
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6818276

Thermal stamping apparatus
patent, December 1980

Izumihara, Hiroshi
US Patent Document 4,242,166
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/4242166

Thermal stamping device
patent, April 1981

Izumihara, Hiroshi
US Patent Document 4,264,394
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/4264394

Pressure controlled heat source and method for using such for RTP
patent, May 2004

Kellerman, Peter L.; Carlson, Frederick M.
US Patent Document 6,735,378
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6735378

Machine tool for stamping, nibbling and thermal cutting and the like
patent, April 1986

Klingel, Hans
US Patent Document 4,583,719
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/4583719

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Similar Records

Title: Rapid thermal processing by stamping

Abstract

Citation Formats

Speaker adapted to corner-loaded installation patent, February 1986

Solution deposition of chalcogenide films patent, April 2005

Method for forming polycrystalline silicon from the crystallization of microcrystalline silicon patent, October 1998

Solid phase crystallization of thin films of Si prepared by plasma‐enhanced chemical vapor deposition journal, July 1993

Method for heating and cooling substrates patent, December 2003

Light management film with colorant receiving layer patent, November 2004

Thermal stamping apparatus patent, December 1980

Thermal stamping device patent, April 1981

Pressure controlled heat source and method for using such for RTP patent, May 2004

Machine tool for stamping, nibbling and thermal cutting and the like patent, April 1986

Speaker adapted to corner-loaded installation
patent, February 1986

Solution deposition of chalcogenide films
patent, April 2005

Method for forming polycrystalline silicon from the crystallization of microcrystalline silicon
patent, October 1998

Solid phase crystallization of thin films of Si prepared by plasma‐enhanced chemical vapor deposition
journal, July 1993

Method for heating and cooling substrates
patent, December 2003

Light management film with colorant receiving layer
patent, November 2004

Thermal stamping apparatus
patent, December 1980

Thermal stamping device
patent, April 1981

Pressure controlled heat source and method for using such for RTP
patent, May 2004

Machine tool for stamping, nibbling and thermal cutting and the like
patent, April 1986