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Title: Adhesive flexible barrier film, method of forming same, and organic electronic device including same

Abstract

An adhesive flexible barrier film comprises a substrate and a barrier layer disposed on the substrate. The barrier layer is formed from a barrier composition comprising an organosilicon compound. The adhesive flexible barrier film also comprises an adhesive layer disposed on the barrier layer and formed from an adhesive composition. A method of forming the adhesive flexible barrier film comprises the steps of disposing the barrier composition on the substrate to form the barrier layer, disposing the adhesive composition on the barrier layer to form the adhesive layer, and curing the barrier layer and the adhesive layer. The adhesive flexible barrier film may be utilized in organic electronic devices.

Inventors:
;
Issue Date:
Research Org.:
Dow Corning Corporation (Midland, MI)
Sponsoring Org.:
USDOE
OSTI Identifier:
1083215
Patent Number(s):
8368218
Application Number:
13/144,395
Assignee:
Dow Corning Corporation (Midland, MI)
Patent Classifications (CPCs):
C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08K - Use of inorganic or non-macromolecular organic substances as compounding ingredients
C - CHEMISTRY C09 - DYES C09J - ADHESIVES
DOE Contract Number:  
FC26-05NT42344
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Blizzard, John Donald, and Weidner, William Kenneth. Adhesive flexible barrier film, method of forming same, and organic electronic device including same. United States: N. p., 2013. Web.
Blizzard, John Donald, & Weidner, William Kenneth. Adhesive flexible barrier film, method of forming same, and organic electronic device including same. United States.
Blizzard, John Donald, and Weidner, William Kenneth. Tue . "Adhesive flexible barrier film, method of forming same, and organic electronic device including same". United States. https://www.osti.gov/servlets/purl/1083215.
@article{osti_1083215,
title = {Adhesive flexible barrier film, method of forming same, and organic electronic device including same},
author = {Blizzard, John Donald and Weidner, William Kenneth},
abstractNote = {An adhesive flexible barrier film comprises a substrate and a barrier layer disposed on the substrate. The barrier layer is formed from a barrier composition comprising an organosilicon compound. The adhesive flexible barrier film also comprises an adhesive layer disposed on the barrier layer and formed from an adhesive composition. A method of forming the adhesive flexible barrier film comprises the steps of disposing the barrier composition on the substrate to form the barrier layer, disposing the adhesive composition on the barrier layer to form the adhesive layer, and curing the barrier layer and the adhesive layer. The adhesive flexible barrier film may be utilized in organic electronic devices.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Feb 05 00:00:00 EST 2013},
month = {Tue Feb 05 00:00:00 EST 2013}
}

Works referenced in this record:

Packaged adhesive
patent, August 1988


Multilayer film structure and packages therefrom for organics
patent, September 2000


Film for organic EL device and an organic EL device using the film
patent, May 2005


Coatings with low permeation of gases and vapors
patent, July 2006


Flexible barrier film structure
patent, December 2010