Encapsulant materials and associated devices
Abstract
Compositions suitable for use as encapsulants are described. The inventive compositions include a high molecular weight polymeric material, a curing agent, an inorganic compound, and a coupling agent. Optional elements include adhesion promoting agents, colorants, antioxidants, and UV absorbers. The compositions have desirable diffusivity properties, making them suitable for use in devices in which a substantial blocking of moisture ingress is desired, such as photovoltaic (PV) modules.
- Inventors:
-
- Littleton, CO
- Lima, OH
- Issue Date:
- Research Org.:
- BRP Manufacturing Company (Lima, OH); Alliance For Sustainable Energy, LLC (Golden, CO)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1016539
- Patent Number(s):
- 7902301
- Application Number:
- US Patent Application 12/131,211
- Assignee:
- BRP Manufacturing Company (Lima, OH); Alliance For Sustainable Energy, LLC (Golden, CO)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08K - Use of inorganic or non-macromolecular organic substances as compounding ingredients
C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08L - COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- DOE Contract Number:
- AC36-99GO10337
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Kempe, Michael D, and Thapa, Prem. Encapsulant materials and associated devices. United States: N. p., 2011.
Web.
Kempe, Michael D, & Thapa, Prem. Encapsulant materials and associated devices. United States.
Kempe, Michael D, and Thapa, Prem. Tue .
"Encapsulant materials and associated devices". United States. https://www.osti.gov/servlets/purl/1016539.
@article{osti_1016539,
title = {Encapsulant materials and associated devices},
author = {Kempe, Michael D and Thapa, Prem},
abstractNote = {Compositions suitable for use as encapsulants are described. The inventive compositions include a high molecular weight polymeric material, a curing agent, an inorganic compound, and a coupling agent. Optional elements include adhesion promoting agents, colorants, antioxidants, and UV absorbers. The compositions have desirable diffusivity properties, making them suitable for use in devices in which a substantial blocking of moisture ingress is desired, such as photovoltaic (PV) modules.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Mar 08 00:00:00 EST 2011},
month = {Tue Mar 08 00:00:00 EST 2011}
}
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Works referenced in this record:
Moisture transport, adhesion, and corrosion protection of PV module packaging materials
journal, October 2006
- Jorgensen, G.; Terwilliger, K.; Delcueto, J.
- Solar Energy Materials and Solar Cells, Vol. 90, Issue 16
Modeling of rates of moisture ingress into photovoltaic modules
journal, October 2006
- Kempe, Michael D.
- Solar Energy Materials and Solar Cells, Vol. 90, Issue 16, p. 2720-2738
Acetic acid production and glass transition concerns with ethylene-vinyl acetate used in photovoltaic devices
journal, February 2007
- Kempe, Michael D.; Jorgensen, Gary J.; Terwilliger, Kent M.
- Solar Energy Materials and Solar Cells, Vol. 91, Issue 4