Near single-crystalline, high-carrier-mobility silicon thin film on a polycrystalline/amorphous substrate
Abstract
A template article including a base substrate including: (i) a base material selected from the group consisting of polycrystalline substrates and amorphous substrates, and (ii) at least one layer of a differing material upon the surface of the base material; and, a buffer material layer upon the base substrate, the buffer material layer characterized by: (a) low chemical reactivity with the base substrate, (b) stability at temperatures up to at least about 800.degree. C. under low vacuum conditions, and (c) a lattice crystal structure adapted for subsequent deposition of a semiconductor material; is provided, together with a semiconductor article including a base substrate including: (i) a base material selected from the group consisting of polycrystalline substrates and amorphous substrates, and (ii) at least one layer of a differing material upon the surface of the base material; and, a buffer material layer upon the base substrate, the buffer material layer characterized by: (a) low chemical reactivity with the base substrate, (b) stability at temperatures up to at least about 800.degree. C. under low vacuum conditions, and (c) a lattice crystal structure adapted for subsequent deposition of a semiconductor material, and, a top-layer of semiconductor material upon the buffer material layer.
- Inventors:
-
- Los Alamos, NM
- Santa Fe, NM
- Issue Date:
- Research Org.:
- Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 989007
- Patent Number(s):
- 7608335
- Application Number:
- 11/001,461
- Assignee:
- Los Alamos National Security, LLC (Los Alamos, NM)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C30 - CRYSTAL GROWTH C30B - SINGLE-CRYSTAL-GROWTH
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- W-7405-ENG-36
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Findikoglu, Alp T, Jia, Quanxi, Arendt, Paul N, Matias, Vladimir, and Choi, Woong. Near single-crystalline, high-carrier-mobility silicon thin film on a polycrystalline/amorphous substrate. United States: N. p., 2009.
Web.
Findikoglu, Alp T, Jia, Quanxi, Arendt, Paul N, Matias, Vladimir, & Choi, Woong. Near single-crystalline, high-carrier-mobility silicon thin film on a polycrystalline/amorphous substrate. United States.
Findikoglu, Alp T, Jia, Quanxi, Arendt, Paul N, Matias, Vladimir, and Choi, Woong. Tue .
"Near single-crystalline, high-carrier-mobility silicon thin film on a polycrystalline/amorphous substrate". United States. https://www.osti.gov/servlets/purl/989007.
@article{osti_989007,
title = {Near single-crystalline, high-carrier-mobility silicon thin film on a polycrystalline/amorphous substrate},
author = {Findikoglu, Alp T and Jia, Quanxi and Arendt, Paul N and Matias, Vladimir and Choi, Woong},
abstractNote = {A template article including a base substrate including: (i) a base material selected from the group consisting of polycrystalline substrates and amorphous substrates, and (ii) at least one layer of a differing material upon the surface of the base material; and, a buffer material layer upon the base substrate, the buffer material layer characterized by: (a) low chemical reactivity with the base substrate, (b) stability at temperatures up to at least about 800.degree. C. under low vacuum conditions, and (c) a lattice crystal structure adapted for subsequent deposition of a semiconductor material; is provided, together with a semiconductor article including a base substrate including: (i) a base material selected from the group consisting of polycrystalline substrates and amorphous substrates, and (ii) at least one layer of a differing material upon the surface of the base material; and, a buffer material layer upon the base substrate, the buffer material layer characterized by: (a) low chemical reactivity with the base substrate, (b) stability at temperatures up to at least about 800.degree. C. under low vacuum conditions, and (c) a lattice crystal structure adapted for subsequent deposition of a semiconductor material, and, a top-layer of semiconductor material upon the buffer material layer.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2009},
month = {10}
}