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Title: Method for atmospheric pressure reactive atom plasma processing for surface modification

Abstract

Reactive atom plasma processing can be used to shape, polish, planarize and clean the surfaces of difficult materials with minimal subsurface damage. The apparatus and methods use a plasma torch, such as a conventional ICP torch. The workpiece and plasma torch are moved with respect to each other, whether by translating and/or rotating the workpiece, the plasma, or both. The plasma discharge from the torch can be used to shape, planarize, polish, and/or clean the surface of the workpiece, as well as to thin the workpiece. The processing may cause minimal or no damage to the workpiece underneath the surface, and may involve removing material from the surface of the workpiece.

Inventors:
 [1]
  1. Livermore, CA
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
988697
Patent Number(s):
7591957
Application Number:
10/002,483
Assignee:
RAPT Industries, Inc. (Fremont, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05H - PLASMA TECHNIQUE
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
47 OTHER INSTRUMENTATION

Citation Formats

Carr, Jeffrey W. Method for atmospheric pressure reactive atom plasma processing for surface modification. United States: N. p., 2009. Web.
Carr, Jeffrey W. Method for atmospheric pressure reactive atom plasma processing for surface modification. United States.
Carr, Jeffrey W. Tue . "Method for atmospheric pressure reactive atom plasma processing for surface modification". United States. https://www.osti.gov/servlets/purl/988697.
@article{osti_988697,
title = {Method for atmospheric pressure reactive atom plasma processing for surface modification},
author = {Carr, Jeffrey W},
abstractNote = {Reactive atom plasma processing can be used to shape, polish, planarize and clean the surfaces of difficult materials with minimal subsurface damage. The apparatus and methods use a plasma torch, such as a conventional ICP torch. The workpiece and plasma torch are moved with respect to each other, whether by translating and/or rotating the workpiece, the plasma, or both. The plasma discharge from the torch can be used to shape, planarize, polish, and/or clean the surface of the workpiece, as well as to thin the workpiece. The processing may cause minimal or no damage to the workpiece underneath the surface, and may involve removing material from the surface of the workpiece.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2009},
month = {9}
}

Works referenced in this record:

Rapid, noncontact optical figuring of aspheric surfaces with plasma-assisted chemical etching
conference, November 1990


Production of chemically active species in the air by a single positive streamer in a nonuniform field
journal, June 1997


Computer numerically controlled plasma chemical vaporization machining with a pipe electrode for optical fabrication
journal, January 1998


Rapid, noncontact, damage free shaping of optical and other surfaces with plasma assisted chemical etching
conference, January 1989