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Title: Thermally stable diamond brazing

Abstract

A cutting element and a method for forming a cutting element is described and shown. The cutting element includes a substrate, a TSP diamond layer, a metal interlayer between the substrate and the diamond layer, and a braze joint securing the diamond layer to the substrate. The thickness of the metal interlayer is determined according to a formula. The formula takes into account the thickness and modulus of elasticity of the metal interlayer and the thickness of the TSP diamond. This prevents the use of a too thin or too thick metal interlayer. A metal interlayer that is too thin is not capable of absorbing enough energy to prevent the TSP diamond from fracturing. A metal interlayer that is too thick may allow the TSP diamond to fracture by reason of bending stress. A coating may be provided between the TSP diamond layer and the metal interlayer. This coating serves as a thermal barrier and to control residual thermal stress.

Inventors:
 [1]
  1. Kingwood, TX
Issue Date:
Research Org.:
Technology International Inc
Sponsoring Org.:
USDOE
OSTI Identifier:
988352
Patent Number(s):
7487849
Application Number:
11/130,036
Assignee:
Technology International Inc
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
E - FIXED CONSTRUCTIONS E21 - EARTH DRILLING E21B - EARTH DRILLING, e.g. DEEP DRILLING
DOE Contract Number:  
FC26-97FT34368
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
47 OTHER INSTRUMENTATION

Citation Formats

Radtke, Robert P. Thermally stable diamond brazing. United States: N. p., 2009. Web.
Radtke, Robert P. Thermally stable diamond brazing. United States.
Radtke, Robert P. Tue . "Thermally stable diamond brazing". United States. https://www.osti.gov/servlets/purl/988352.
@article{osti_988352,
title = {Thermally stable diamond brazing},
author = {Radtke, Robert P},
abstractNote = {A cutting element and a method for forming a cutting element is described and shown. The cutting element includes a substrate, a TSP diamond layer, a metal interlayer between the substrate and the diamond layer, and a braze joint securing the diamond layer to the substrate. The thickness of the metal interlayer is determined according to a formula. The formula takes into account the thickness and modulus of elasticity of the metal interlayer and the thickness of the TSP diamond. This prevents the use of a too thin or too thick metal interlayer. A metal interlayer that is too thin is not capable of absorbing enough energy to prevent the TSP diamond from fracturing. A metal interlayer that is too thick may allow the TSP diamond to fracture by reason of bending stress. A coating may be provided between the TSP diamond layer and the metal interlayer. This coating serves as a thermal barrier and to control residual thermal stress.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2009},
month = {2}
}

Patent:

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