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Title: Devices using resin wafers and applications thereof

Abstract

Devices incorporating a thin wafer of electrically and ionically conductive porous material made by the method of introducing a mixture of a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material into a mold. The mixture is subjected to temperatures in the range of from about 60.degree. C. to about 170.degree. C. at pressures in the range of from about 0 to about 500 psig for a time in the range of from about 1 to about 240 minutes to form thin wafers. Devices include electrodeionization and separative bioreactors in the production of organic and amino acids, alcohols or esters for regenerating cofactors in enzymes and microbial cells.

Inventors:
 [1];  [2];  [3];  [4];  [5];  [5]
  1. Naperville, IL
  2. Batavia, IL
  3. Lincolnwood, IL
  4. Libertyville, IL
  5. Woodridge, IL
Issue Date:
Research Org.:
Argonne National Lab. (ANL), Argonne, IL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
986340
Patent Number(s):
7507318
Application Number:
11/082,469
Assignee:
Uchicago Argonne, LLC (Chicago, IL)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01M - PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
B - PERFORMING OPERATIONS B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL B01J - CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY
DOE Contract Number:  
W-31-109-ENG-38
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Lin, YuPo J, Henry, Michael P, Snyder, Seth W, Martin, Edward, Arora, Michelle, and de la Garza, Linda. Devices using resin wafers and applications thereof. United States: N. p., 2009. Web.
Lin, YuPo J, Henry, Michael P, Snyder, Seth W, Martin, Edward, Arora, Michelle, & de la Garza, Linda. Devices using resin wafers and applications thereof. United States.
Lin, YuPo J, Henry, Michael P, Snyder, Seth W, Martin, Edward, Arora, Michelle, and de la Garza, Linda. Tue . "Devices using resin wafers and applications thereof". United States. https://www.osti.gov/servlets/purl/986340.
@article{osti_986340,
title = {Devices using resin wafers and applications thereof},
author = {Lin, YuPo J and Henry, Michael P and Snyder, Seth W and Martin, Edward and Arora, Michelle and de la Garza, Linda},
abstractNote = {Devices incorporating a thin wafer of electrically and ionically conductive porous material made by the method of introducing a mixture of a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material into a mold. The mixture is subjected to temperatures in the range of from about 60.degree. C. to about 170.degree. C. at pressures in the range of from about 0 to about 500 psig for a time in the range of from about 1 to about 240 minutes to form thin wafers. Devices include electrodeionization and separative bioreactors in the production of organic and amino acids, alcohols or esters for regenerating cofactors in enzymes and microbial cells.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2009},
month = {3}
}

Patent:

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