Title: Method of processing a substrate

Abstract

The invention is embodied in a plasma flow device or reactor having a housing that contains conductive electrodes with openings to allow gas to flow through or around them, where one or more of the electrodes are powered by an RF source and one or more are grounded, and a substrate or work piece is placed in the gas flow downstream of the electrodes, such that said substrate or work piece is substantially uniformly contacted across a large surface area with the reactive gases emanating therefrom. The invention is also embodied in a plasma flow device or reactor having a housing that contains conductive electrodes with openings to allow gas to flow through or around them, where one or more of the electrodes are powered by an RF source and one or more are grounded, and one of the grounded electrodes contains a means of mixing in other chemical precursors to combine with the plasma stream, and a substrate or work piece placed in the gas flow downstream of the electrodes, such that said substrate or work piece is contacted by the reactive gases emanating therefrom. In one embodiment, the plasma flow device removes organic materials from a substrate ormore » work piece, and is a stripping or cleaning device. In another embodiment, the plasma flow device kills biological microorganisms on a substrate or work piece, and is a sterilization device. In another embodiment, the plasma flow device activates the surface of a substrate or work piece, and is a surface activation device. In another embodiment, the plasma flow device etches materials from a substrate or work piece, and is a plasma etcher. In another embodiment, the plasma flow device deposits thin films onto a substrate or work piece, and is a plasma-enhanced chemical vapor deposition device or reactor.« less

Inventors:

Babayan, Steven E ^[1]; Hicks, Robert F ^[2]

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+ Show Inventor Affiliations

1. Huntington Beach, CA
2. Los Angeles, CA

Issue Date:

2008-02-12

Research Org.:

University of California (Oakland, CA)

Sponsoring Org.:

USDOE

OSTI Identifier:

983908

Patent Number(s):

7329608

Application Number:

s 10/982,120

Assignee:

The Regents of the University of California (Oakland, CA)

Patent Classifications (CPCs):

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L2924/16152 - Cap comprising a cavity for hosting the device, e.g. U-shaped cap
H01L2924/3011 - Impedance
H01L2924/16195 - Flat cap [not enclosing an internal cavity]
H01L51/5246 - {characterised by the peripheral sealing arrangements, e.g. adhesives, sealants}
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L51/524 - {Sealing arrangements having a self-supporting structure, e.g. containers}
H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L23/26 - including materials for absorbing or reacting with moisture or other undesired substances {, e.g. getters}
H01L2251/566 - Division of substrate, e.g. for manufacturing of OLED dsiplays
H01L23/10 - characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
H01L23/08 - the material being an electrical insulator, e.g. glass
H01L51/5259 - {including getter material or desiccant}
H01L51/5253 - {Protective coatings}
H01L2924/12044 - OLED
H01L2924/09701 - Low temperature co-fired ceramic [LTCC]
H01L2924/01079 - Gold [Au]

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DOE Contract Number:  

FG07-96ER45621

Resource Type:

Patent

Country of Publication:

United States

Language:

English

Subject:

47 OTHER INSTRUMENTATION