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Title: Photoresist substrate having robust adhesion

Abstract

A substrate material for LIGA applications w hose general composition is Ti/Cu/Ti/SiO.sub.2. The SiO.sub.2 is preferably applied to the Ti/Cu/Ti wafer as a sputtered coating, typically about 100 nm thick. This substrate composition provides improved adhesion for epoxy-based photoresist materials, and particularly the photoresist material SU-8.

Inventors:
 [1]
  1. Sunol, CA
Issue Date:
Research Org.:
Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
973147
Patent Number(s):
6921630
Application Number:
10/285,060
Assignee:
Sandia National Laboratories (Livermore, CA)
Patent Classifications (CPCs):
G - PHYSICS G03 - PHOTOGRAPHY G03F - PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Dentinger, Paul M. Photoresist substrate having robust adhesion. United States: N. p., 2005. Web.
Dentinger, Paul M. Photoresist substrate having robust adhesion. United States.
Dentinger, Paul M. Tue . "Photoresist substrate having robust adhesion". United States. https://www.osti.gov/servlets/purl/973147.
@article{osti_973147,
title = {Photoresist substrate having robust adhesion},
author = {Dentinger, Paul M},
abstractNote = {A substrate material for LIGA applications w hose general composition is Ti/Cu/Ti/SiO.sub.2. The SiO.sub.2 is preferably applied to the Ti/Cu/Ti wafer as a sputtered coating, typically about 100 nm thick. This substrate composition provides improved adhesion for epoxy-based photoresist materials, and particularly the photoresist material SU-8.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2005},
month = {7}
}

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Works referenced in this record:

Fabrication of high-aspect-ratio microstructure on metallic substrate using SU-8 resist
conference, October 2001


An investigation of SU-8 resist adhesion in deep x-ray lithography of high-aspect-ratio structures
conference, April 2004