Photoresist substrate having robust adhesion
Abstract
A substrate material for LIGA applications w hose general composition is Ti/Cu/Ti/SiO.sub.2. The SiO.sub.2 is preferably applied to the Ti/Cu/Ti wafer as a sputtered coating, typically about 100 nm thick. This substrate composition provides improved adhesion for epoxy-based photoresist materials, and particularly the photoresist material SU-8.
- Inventors:
-
- Sunol, CA
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-CA), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 973147
- Patent Number(s):
- 6921630
- Application Number:
- 10/285,060
- Assignee:
- Sandia National Laboratories (Livermore, CA)
- Patent Classifications (CPCs):
-
G - PHYSICS G03 - PHOTOGRAPHY G03F - PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Dentinger, Paul M. Photoresist substrate having robust adhesion. United States: N. p., 2005.
Web.
Dentinger, Paul M. Photoresist substrate having robust adhesion. United States.
Dentinger, Paul M. Tue .
"Photoresist substrate having robust adhesion". United States. https://www.osti.gov/servlets/purl/973147.
@article{osti_973147,
title = {Photoresist substrate having robust adhesion},
author = {Dentinger, Paul M},
abstractNote = {A substrate material for LIGA applications w hose general composition is Ti/Cu/Ti/SiO.sub.2. The SiO.sub.2 is preferably applied to the Ti/Cu/Ti wafer as a sputtered coating, typically about 100 nm thick. This substrate composition provides improved adhesion for epoxy-based photoresist materials, and particularly the photoresist material SU-8.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2005},
month = {7}
}
Works referenced in this record:
Fabrication of high-aspect-ratio microstructure on metallic substrate using SU-8 resist
conference, October 2001
- Liu, Jingquan; Cai, Bingchu; Zhu, Jun
- International Symposium on Optoelectonics and Microelectronics, SPIE Proceedings
An investigation of SU-8 resist adhesion in deep x-ray lithography of high-aspect-ratio structures
conference, April 2004
- Barber, Richard L.; Ghantasala, Muralidhar K.; Divan, Ralu
- Microelectronics, MEMS, and Nanotechnology, SPIE Proceedings