Photoresist substrate having robust adhesion

Title: Photoresist substrate having robust adhesion

Abstract

A substrate material for LIGA applications w hose general composition is Ti/Cu/Ti/SiO.sub.2. The SiO.sub.2 is preferably applied to the Ti/Cu/Ti wafer as a sputtered coating, typically about 100 nm thick. This substrate composition provides improved adhesion for epoxy-based photoresist materials, and particularly the photoresist material SU-8.

Inventors:

Dentinger, Paul M ^[1]

Sunol, CA

Issue Date:: 2005-07-26

Research Org.:: Sandia National Lab. (SNL-CA), Livermore, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 973147

Patent Number(s):: 6921630

Application Number:: 10/285,060

Assignee:: Sandia National Laboratories (Livermore, CA)

Patent Classifications (CPCs):: G - PHYSICS G03 - PHOTOGRAPHY G03F - PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES

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G - PHYSICS G03 - PHOTOGRAPHY G03F - PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES
G03F7/11 - having cover layers or intermediate layers, e.g. subbing layers {
G03F7/16 - Coating processes

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DOE Contract Number:: AC04-94AL85000

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE

Citation Formats


                    Dentinger, Paul M. Photoresist substrate having robust adhesion.  United States: N. p., 2005. 
        Web.

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                    Dentinger, Paul M. Photoresist substrate having robust adhesion.  United States.

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                    Dentinger, Paul M. Tue .  
        "Photoresist substrate having robust adhesion".  United States.  https://www.osti.gov/servlets/purl/973147.

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@article{osti_973147,

  title        = {Photoresist substrate having robust adhesion},

  author       = {Dentinger, Paul M},

  abstractNote = {A substrate material for LIGA applications w hose general composition is Ti/Cu/Ti/SiO.sub.2. The SiO.sub.2 is preferably applied to the Ti/Cu/Ti wafer as a sputtered coating, typically about 100 nm thick. This substrate composition provides improved adhesion for epoxy-based photoresist materials, and particularly the photoresist material SU-8.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2005},

  month        = {7}

}

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Works referenced in this record:

Fabrication of high-aspect-ratio microstructure on metallic substrate using SU-8 resist
conference, October 2001

Liu, Jingquan; Cai, Bingchu; Zhu, Jun
International Symposium on Optoelectonics and Microelectronics, SPIE Proceedings
https://doi.org/10.1117/12.444698

An investigation of SU-8 resist adhesion in deep x-ray lithography of high-aspect-ratio structures
conference, April 2004

Barber, Richard L.; Ghantasala, Muralidhar K.; Divan, Ralu
Microelectronics, MEMS, and Nanotechnology, SPIE Proceedings
https://doi.org/10.1117/12.521170

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Title: Photoresist substrate having robust adhesion

Abstract

Citation Formats

Fabrication of high-aspect-ratio microstructure on metallic substrate using SU-8 resist conference, October 2001

An investigation of SU-8 resist adhesion in deep x-ray lithography of high-aspect-ratio structures conference, April 2004

Fabrication of high-aspect-ratio microstructure on metallic substrate using SU-8 resist
conference, October 2001

An investigation of SU-8 resist adhesion in deep x-ray lithography of high-aspect-ratio structures
conference, April 2004