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Title: Dynamic mask for producing uniform or graded-thickness thin films

Abstract

A method for producing single layer or multilayer films with high thickness uniformity or thickness gradients. The method utilizes a moving mask which blocks some of the flux from a sputter target or evaporation source before it deposits on a substrate. The velocity and position of the mask is computer controlled to precisely tailor the film thickness distribution. The method is applicable to any type of vapor deposition system, but is particularly useful for ion beam sputter deposition and evaporation deposition; and enables a high degree of uniformity for ion beam deposition, even for near-normal incidence of deposition species, which may be critical for producing low-defect multilayer coatings, such as required for masks for extreme ultraviolet lithography (EUVL). The mask can have a variety of shapes, from a simple solid paddle shape to a larger mask with a shaped hole through which the flux passes. The motion of the mask can be linear or rotational, and the mask can be moved to make single or multiple passes in front of the substrate per layer, and can pass completely or partially across the substrate.

Inventors:
 [1]
  1. Livermore, CA
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
973143
Patent Number(s):
7062348
Application Number:
09/615,281
Assignee:
The Extreme Ultaviolet Lithography LLC (Santa Clara, CA)
Patent Classifications (CPCs):
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Folta, James A. Dynamic mask for producing uniform or graded-thickness thin films. United States: N. p., 2006. Web.
Folta, James A. Dynamic mask for producing uniform or graded-thickness thin films. United States.
Folta, James A. Tue . "Dynamic mask for producing uniform or graded-thickness thin films". United States. https://www.osti.gov/servlets/purl/973143.
@article{osti_973143,
title = {Dynamic mask for producing uniform or graded-thickness thin films},
author = {Folta, James A},
abstractNote = {A method for producing single layer or multilayer films with high thickness uniformity or thickness gradients. The method utilizes a moving mask which blocks some of the flux from a sputter target or evaporation source before it deposits on a substrate. The velocity and position of the mask is computer controlled to precisely tailor the film thickness distribution. The method is applicable to any type of vapor deposition system, but is particularly useful for ion beam sputter deposition and evaporation deposition; and enables a high degree of uniformity for ion beam deposition, even for near-normal incidence of deposition species, which may be critical for producing low-defect multilayer coatings, such as required for masks for extreme ultraviolet lithography (EUVL). The mask can have a variety of shapes, from a simple solid paddle shape to a larger mask with a shaped hole through which the flux passes. The motion of the mask can be linear or rotational, and the mask can be moved to make single or multiple passes in front of the substrate per layer, and can pass completely or partially across the substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2006},
month = {6}
}

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Works referenced in this record:

Automatic Electron-Beam Deposition Of Multilayer Soft X-Ray Coatings With Laterally Graded D-Spacing
journal, August 1986