Apparatus and method for electroforming high aspect ratio micro-parts
Abstract
A fixture is disclosed to more easily affix a workpiece in the proper orientation and spacing with sealed electrical interconnection within an electrochemical plating bath. The workpiece can be any planar metallic or non-metallic substrate such as a silicon wafer commonly used in LIGA or microsystem fabrication. The fixture described allows the workpiece to be submerged deep within an electrolytic cell, facing upwards, and allows easy transfer from one cell to another. The edges, backside, and electrical connections are sealed and protected from the electrolyte.
- Inventors:
-
- Stockton, CA
- Rancho Cucamonga, CA
- Manteca, CA
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-CA), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 971537
- Patent Number(s):
- 7608174
- Application Number:
- 11/599,766
- Assignee:
- Sandia Corporation (Livermore, CA)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Hachman, John T, Losey, Matthew W, and McLean, Dorrance E. Apparatus and method for electroforming high aspect ratio micro-parts. United States: N. p., 2009.
Web.
Hachman, John T, Losey, Matthew W, & McLean, Dorrance E. Apparatus and method for electroforming high aspect ratio micro-parts. United States.
Hachman, John T, Losey, Matthew W, and McLean, Dorrance E. Fri .
"Apparatus and method for electroforming high aspect ratio micro-parts". United States. https://www.osti.gov/servlets/purl/971537.
@article{osti_971537,
title = {Apparatus and method for electroforming high aspect ratio micro-parts},
author = {Hachman, John T and Losey, Matthew W and McLean, Dorrance E},
abstractNote = {A fixture is disclosed to more easily affix a workpiece in the proper orientation and spacing with sealed electrical interconnection within an electrochemical plating bath. The workpiece can be any planar metallic or non-metallic substrate such as a silicon wafer commonly used in LIGA or microsystem fabrication. The fixture described allows the workpiece to be submerged deep within an electrolytic cell, facing upwards, and allows easy transfer from one cell to another. The edges, backside, and electrical connections are sealed and protected from the electrolyte.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2009},
month = {11}
}
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