Apparatus and method for electroforming high aspect ratio micro-parts

Hachman, John T; Losey, Matthew W; McLean, Dorrance E

Title: Apparatus and method for electroforming high aspect ratio micro-parts

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Abstract

A fixture is disclosed to more easily affix a workpiece in the proper orientation and spacing with sealed electrical interconnection within an electrochemical plating bath. The workpiece can be any planar metallic or non-metallic substrate such as a silicon wafer commonly used in LIGA or microsystem fabrication. The fixture described allows the workpiece to be submerged deep within an electrolytic cell, facing upwards, and allows easy transfer from one cell to another. The edges, backside, and electrical connections are sealed and protected from the electrolyte.

Inventors:

Hachman, John T ^[1]; Losey, Matthew W ^[2]; McLean, Dorrance E ^[3]

Stockton, CA
Rancho Cucamonga, CA
Manteca, CA

Issue Date:: 2009-11-27

Research Org.:: Sandia National Lab. (SNL-CA), Livermore, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 971537

Patent Number(s):: 7608174

Application Number:: 11/599,766

Assignee:: Sandia Corporation (Livermore, CA)

Patent Classifications (CPCs):: C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS

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C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
C25D1/02 - Tubes
C25D1/003 - {3D structures, e.g. superposed patterned layers}
C25D1/00 - Electroforming
C25D5/18 - Electroplating using modulated, pulsed or reversing current
C25D1/22 - Separating compounds
C25D17/008 - {Current insulating devices}
C25D17/06 - Suspending or supporting devices for articles to be coated

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DOE Contract Number:: AC04-94AL85000

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING

Citation Formats


                    Hachman, John T, Losey, Matthew W, and McLean, Dorrance E. Apparatus and method for electroforming high aspect ratio micro-parts.  United States: N. p., 2009. 
        Web.

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                    Hachman, John T, Losey, Matthew W, & McLean, Dorrance E. Apparatus and method for electroforming high aspect ratio micro-parts.  United States.

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                    Hachman, John T, Losey, Matthew W, and McLean, Dorrance E. Fri .  
        "Apparatus and method for electroforming high aspect ratio micro-parts".  United States.  https://www.osti.gov/servlets/purl/971537.

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@article{osti_971537,

  title        = {Apparatus and method for electroforming high aspect ratio micro-parts},

  author       = {Hachman, John T and Losey, Matthew W and McLean, Dorrance E},

  abstractNote = {A fixture is disclosed to more easily affix a workpiece in the proper orientation and spacing with sealed electrical interconnection within an electrochemical plating bath. The workpiece can be any planar metallic or non-metallic substrate such as a silicon wafer commonly used in LIGA or microsystem fabrication. The fixture described allows the workpiece to be submerged deep within an electrolytic cell, facing upwards, and allows easy transfer from one cell to another. The edges, backside, and electrical connections are sealed and protected from the electrolyte.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2009},

  month        = {11}

}

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