Tensile-stressed microelectromechanical apparatus and microelectromechanical relay formed therefrom
Abstract
A microelectromechanical (MEM) apparatus is disclosed which includes a shuttle suspended above a substrate by two or more sets of tensile-stressed beams which are operatively connected to the shuttle and which can comprise tungsten or a silicon nitride/polysilicon composite structure. Initially, the tensile stress in each set of beams is balanced. However, the tensile stress can be unbalanced by heating one or more of the sets of beams; and this can be used to move the shuttle over a distance of up to several tens of microns. The MEM apparatus can be used to form a MEM relay having relatively high contact and opening forces, and with or without a latching capability.
- Inventors:
-
- Albuquerque, NM
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 970552
- Patent Number(s):
- 7339454
- Application Number:
- 11/103,311
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01H - ELECTRIC SWITCHES
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 47 OTHER INSTRUMENTATION
Citation Formats
Fleming, James G. Tensile-stressed microelectromechanical apparatus and microelectromechanical relay formed therefrom. United States: N. p., 2008.
Web.
Fleming, James G. Tensile-stressed microelectromechanical apparatus and microelectromechanical relay formed therefrom. United States.
Fleming, James G. Tue .
"Tensile-stressed microelectromechanical apparatus and microelectromechanical relay formed therefrom". United States. https://www.osti.gov/servlets/purl/970552.
@article{osti_970552,
title = {Tensile-stressed microelectromechanical apparatus and microelectromechanical relay formed therefrom},
author = {Fleming, James G},
abstractNote = {A microelectromechanical (MEM) apparatus is disclosed which includes a shuttle suspended above a substrate by two or more sets of tensile-stressed beams which are operatively connected to the shuttle and which can comprise tungsten or a silicon nitride/polysilicon composite structure. Initially, the tensile stress in each set of beams is balanced. However, the tensile stress can be unbalanced by heating one or more of the sets of beams; and this can be used to move the shuttle over a distance of up to several tens of microns. The MEM apparatus can be used to form a MEM relay having relatively high contact and opening forces, and with or without a latching capability.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2008},
month = {3}
}
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