Miniature MT optical assembly (MMTOA)
Abstract
An optical assembly (10) includes a rigid mount (12) with a recess (26) proximate a first side thereof, a substrate (14), and an optical die (16) flip-chip bonded to the substrate (14). The substrate (14) is secured to the first side of the mount and includes a plurality of die bonding elements (40), a plurality of optical apertures (32), and a plurality of external bonding elements (42). A plurality of traces (44) interconnect the die bonding elements (40) and the external bonding elements (42). The optical die (16) includes a plurality of optical elements, each element including an optical signal interface (48), the die being bonded to the plurality of die bonding elements (40) such that the optical signal interface (48) of each element is in registry with an optical aperture (32) of the substrate (14) and the die (16) is at least partially enclosed by the recess (26).
- Inventors:
-
- Overland Park, KS
- Issue Date:
- Research Org.:
- HONEYWELL INTERNATIONAL, INC
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 936226
- Patent Number(s):
- 7350985
- Application Number:
- 11/690,495
- Assignee:
- Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MI)
- Patent Classifications (CPCs):
-
G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC04-01AL66850
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 47 OTHER INSTRUMENTATION
Citation Formats
Laughlin, Daric, and Abel, Phillip. Miniature MT optical assembly (MMTOA). United States: N. p., 2008.
Web.
Laughlin, Daric, & Abel, Phillip. Miniature MT optical assembly (MMTOA). United States.
Laughlin, Daric, and Abel, Phillip. Tue .
"Miniature MT optical assembly (MMTOA)". United States. https://www.osti.gov/servlets/purl/936226.
@article{osti_936226,
title = {Miniature MT optical assembly (MMTOA)},
author = {Laughlin, Daric and Abel, Phillip},
abstractNote = {An optical assembly (10) includes a rigid mount (12) with a recess (26) proximate a first side thereof, a substrate (14), and an optical die (16) flip-chip bonded to the substrate (14). The substrate (14) is secured to the first side of the mount and includes a plurality of die bonding elements (40), a plurality of optical apertures (32), and a plurality of external bonding elements (42). A plurality of traces (44) interconnect the die bonding elements (40) and the external bonding elements (42). The optical die (16) includes a plurality of optical elements, each element including an optical signal interface (48), the die being bonded to the plurality of die bonding elements (40) such that the optical signal interface (48) of each element is in registry with an optical aperture (32) of the substrate (14) and the die (16) is at least partially enclosed by the recess (26).},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Apr 01 00:00:00 EDT 2008},
month = {Tue Apr 01 00:00:00 EDT 2008}
}
Works referenced in this record:
Three-dimensional waveguide arrays for coupling between fiber-optic connectors and surface-mounted optoelectronic devices
journal, September 2005
- Hiramatsu, S.; Kinoshita, M.
- Journal of Lightwave Technology, Vol. 23, Issue 9