Heterogeneously integrated microsystem-on-a-chip
Abstract
A microsystem-on-a-chip comprises a bottom wafer of normal thickness and a series of thinned wafers can be stacked on the bottom wafer, glued and electrically interconnected. The interconnection layer comprises a compliant dielectric material, an interconnect structure, and can include embedded passives. The stacked wafer technology provides a heterogeneously integrated, ultra-miniaturized, higher performing, robust and cost-effective microsystem package. The highly integrated microsystem package, comprising electronics, sensors, optics, and MEMS, can be miniaturized both in volume and footprint to the size of a bottle-cap or less.
- Inventors:
-
- Albuquerque, NM
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 936111
- Patent Number(s):
- 7335972
- Application Number:
- 10/713,374
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Chanchani, Rajen. Heterogeneously integrated microsystem-on-a-chip. United States: N. p., 2008.
Web.
Chanchani, Rajen. Heterogeneously integrated microsystem-on-a-chip. United States.
Chanchani, Rajen. Tue .
"Heterogeneously integrated microsystem-on-a-chip". United States. https://www.osti.gov/servlets/purl/936111.
@article{osti_936111,
title = {Heterogeneously integrated microsystem-on-a-chip},
author = {Chanchani, Rajen},
abstractNote = {A microsystem-on-a-chip comprises a bottom wafer of normal thickness and a series of thinned wafers can be stacked on the bottom wafer, glued and electrically interconnected. The interconnection layer comprises a compliant dielectric material, an interconnect structure, and can include embedded passives. The stacked wafer technology provides a heterogeneously integrated, ultra-miniaturized, higher performing, robust and cost-effective microsystem package. The highly integrated microsystem package, comprising electronics, sensors, optics, and MEMS, can be miniaturized both in volume and footprint to the size of a bottle-cap or less.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2008},
month = {2}
}
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Works referenced in this record:
Low-temperature full wafer adhesive bonding
journal, February 2001
- Niklaus, Frank; Enoksson, Peter; Kälvesten, Edvard
- Journal of Micromechanics and Microengineering, Vol. 11, Issue 2