Compliant layer chucking surface

Blaedel, Kenneth L; Spence, Paul A; Thompson, Samuel L

Title: Compliant layer chucking surface

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Abstract

A method and apparatus are described wherein a thin layer of complaint material is deposited on the surface of a chuck to mitigate the deformation that an entrapped particle might cause in the part, such as a mask or a wafer, that is clamped to the chuck. The harder particle will embed into the softer layer as the clamping pressure is applied. The material composing the thin layer could be a metal or a polymer for vacuum or electrostatic chucks. It may be deposited in various patterns to affect an interrupted surface, such as that of a "pin" chuck, thereby reducing the probability of entrapping a particle.

Inventors:

Blaedel, Kenneth L ^[1]; Spence, Paul A ^[2]; Thompson, Samuel L ^[2]

Dublin, CA
Pleasanton, CA

Issue Date:: 2004-12-28

Research Org.:: Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 921909

Patent Number(s):: 6835415

Application Number:: 10/338,266

Assignee:: EUV LLC (Santa Clara, CA)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L21/02 - Manufacture or treatment of semiconductor devices or of parts thereof

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DOE Contract Number:: W-7405-ENG-48

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE

Citation Formats


                    Blaedel, Kenneth L, Spence, Paul A, and Thompson, Samuel L. Compliant layer chucking surface.  United States: N. p., 2004. 
        Web.

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                    Blaedel, Kenneth L, Spence, Paul A, & Thompson, Samuel L. Compliant layer chucking surface.  United States.

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                    Blaedel, Kenneth L, Spence, Paul A, and Thompson, Samuel L. Tue .  
        "Compliant layer chucking surface".  United States.  https://www.osti.gov/servlets/purl/921909.

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@article{osti_921909,

  title        = {Compliant layer chucking surface},

  author       = {Blaedel, Kenneth L and Spence, Paul A and Thompson, Samuel L},

  abstractNote = {A method and apparatus are described wherein a thin layer of complaint material is deposited on the surface of a chuck to mitigate the deformation that an entrapped particle might cause in the part, such as a mask or a wafer, that is clamped to the chuck. The harder particle will embed into the softer layer as the clamping pressure is applied. The material composing the thin layer could be a metal or a polymer for vacuum or electrostatic chucks. It may be deposited in various patterns to affect an interrupted surface, such as that of a "pin" chuck, thereby reducing the probability of entrapping a particle.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2004},

  month        = {12}

}

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