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Title: Compliant layer chucking surface

Abstract

A method and apparatus are described wherein a thin layer of complaint material is deposited on the surface of a chuck to mitigate the deformation that an entrapped particle might cause in the part, such as a mask or a wafer, that is clamped to the chuck. The harder particle will embed into the softer layer as the clamping pressure is applied. The material composing the thin layer could be a metal or a polymer for vacuum or electrostatic chucks. It may be deposited in various patterns to affect an interrupted surface, such as that of a "pin" chuck, thereby reducing the probability of entrapping a particle.

Inventors:
 [1];  [2];  [2]
  1. Dublin, CA
  2. Pleasanton, CA
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
921909
Patent Number(s):
6835415
Application Number:
10/338,266
Assignee:
EUV LLC (Santa Clara, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Blaedel, Kenneth L, Spence, Paul A, and Thompson, Samuel L. Compliant layer chucking surface. United States: N. p., 2004. Web.
Blaedel, Kenneth L, Spence, Paul A, & Thompson, Samuel L. Compliant layer chucking surface. United States.
Blaedel, Kenneth L, Spence, Paul A, and Thompson, Samuel L. Tue . "Compliant layer chucking surface". United States. https://www.osti.gov/servlets/purl/921909.
@article{osti_921909,
title = {Compliant layer chucking surface},
author = {Blaedel, Kenneth L and Spence, Paul A and Thompson, Samuel L},
abstractNote = {A method and apparatus are described wherein a thin layer of complaint material is deposited on the surface of a chuck to mitigate the deformation that an entrapped particle might cause in the part, such as a mask or a wafer, that is clamped to the chuck. The harder particle will embed into the softer layer as the clamping pressure is applied. The material composing the thin layer could be a metal or a polymer for vacuum or electrostatic chucks. It may be deposited in various patterns to affect an interrupted surface, such as that of a "pin" chuck, thereby reducing the probability of entrapping a particle.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2004},
month = {12}
}

Patent:

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