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Title: Microelectromechanical systems contact stress sensor

Abstract

A microelectromechanical systems stress sensor comprising a microelectromechanical systems silicon body. A recess is formed in the silicon body. A silicon element extends into the recess. The silicon element has limited freedom of movement within the recess. An electrical circuit in the silicon element includes a piezoresistor material that allows for sensing changes in resistance that is proportional to bending of the silicon element.

Inventors:
 [1]
  1. Oakland, CA
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
921497
Patent Number(s):
7311009
Application Number:
11/143,543
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA)
Patent Classifications (CPCs):
G - PHYSICS G01 - MEASURING G01L - MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Kotovsky, Jack. Microelectromechanical systems contact stress sensor. United States: N. p., 2007. Web.
Kotovsky, Jack. Microelectromechanical systems contact stress sensor. United States.
Kotovsky, Jack. Tue . "Microelectromechanical systems contact stress sensor". United States. https://www.osti.gov/servlets/purl/921497.
@article{osti_921497,
title = {Microelectromechanical systems contact stress sensor},
author = {Kotovsky, Jack},
abstractNote = {A microelectromechanical systems stress sensor comprising a microelectromechanical systems silicon body. A recess is formed in the silicon body. A silicon element extends into the recess. The silicon element has limited freedom of movement within the recess. An electrical circuit in the silicon element includes a piezoresistor material that allows for sensing changes in resistance that is proportional to bending of the silicon element.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2007},
month = {12}
}

Works referenced in this record:

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Review Article Tactile sensing for mechatronics—a state of the art survey
journal, February 1999