Packaging of electro-microfluidic devices
Abstract
A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.
- Inventors:
-
- Albuquerque, NM
- Tijeras, NM
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 921326
- Patent Number(s):
- 6548895
- Application Number:
- 09/790,305
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Benavides, Gilbert L, Galambos, Paul C, Emerson, John A, Peterson, Kenneth A, Giunta, Rachel K, Zamora, David Lee, and Watson, Robert D. Packaging of electro-microfluidic devices. United States: N. p., 2003.
Web.
Benavides, Gilbert L, Galambos, Paul C, Emerson, John A, Peterson, Kenneth A, Giunta, Rachel K, Zamora, David Lee, & Watson, Robert D. Packaging of electro-microfluidic devices. United States.
Benavides, Gilbert L, Galambos, Paul C, Emerson, John A, Peterson, Kenneth A, Giunta, Rachel K, Zamora, David Lee, and Watson, Robert D. Tue .
"Packaging of electro-microfluidic devices". United States. https://www.osti.gov/servlets/purl/921326.
@article{osti_921326,
title = {Packaging of electro-microfluidic devices},
author = {Benavides, Gilbert L and Galambos, Paul C and Emerson, John A and Peterson, Kenneth A and Giunta, Rachel K and Zamora, David Lee and Watson, Robert D},
abstractNote = {A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2003},
month = {4}
}
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.
Works referenced in this record:
Electroplated electro-fluidic interconnects for chemical sensors
journal, August 2000
- Enikov, Eniko T.; Boyd, James G.
- Sensors and Actuators A: Physical, Vol. 84, Issue 1-2
Electrical and fluidic packaging of surface micromachined electromicrofluidic devices
conference, August 2000
- Galambos, Paul; Benavides, Gilbert L.
- Micromachining and Microfabrication, SPIE Proceedings
Fluidic interconnects for modular assembly of chemical microsystems
journal, June 1998
- González, C.; Collins, S. D.; Smith, R. L.
- Sensors and Actuators B: Chemical, Vol. 49, Issue 1-2
A new technology for fluidic microsystems based on PCB technology
journal, October 1999
- Merkel, Tobias; Graeber, Michael; Pagel, Lienhard
- Sensors and Actuators A: Physical, Vol. 77, Issue 2
An integrated liquid mixer/valve
journal, September 2000
- Voldman, J.; Gray, M. L.; Schmidt, M. A.
- Journal of Microelectromechanical Systems, Vol. 9, Issue 3
A highly flexible design and production framework for modularized microelectromechanical systems
journal, March 1999
- Schuenemann, M.; Grosser, V.; Leutenbauer, R.
- Sensors and Actuators A: Physical, Vol. 73, Issue 1-2
Low-cost plastic sensor packaging using the open-window package concept
journal, May 1998
- Cotofana, C.; Bossche, A.; Kaldenberg, P.
- Sensors and Actuators A: Physical, Vol. 67, Issue 1-3