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Title: Packaging of electro-microfluidic devices

Abstract

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Inventors:
 [1];  [1];  [1];  [1];  [1];  [1];  [2]
  1. (Albuquerque, NM)
  2. (Tijeras, NM)
Issue Date:
Research Org.:
Sandia Corporation (Albuquerque, NM)
Sponsoring Org.:
USDOE
OSTI Identifier:
921326
Patent Number(s):
6,548,895
Application Number:
09/790,305
Assignee:
Sandia Corporation (Albuquerque, NM) ALO
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Benavides, Gilbert L., Galambos, Paul C., Emerson, John A., Peterson, Kenneth A., Giunta, Rachel K., Zamora, David Lee, and Watson, Robert D. Packaging of electro-microfluidic devices. United States: N. p., 2003. Web.
Benavides, Gilbert L., Galambos, Paul C., Emerson, John A., Peterson, Kenneth A., Giunta, Rachel K., Zamora, David Lee, & Watson, Robert D. Packaging of electro-microfluidic devices. United States.
Benavides, Gilbert L., Galambos, Paul C., Emerson, John A., Peterson, Kenneth A., Giunta, Rachel K., Zamora, David Lee, and Watson, Robert D. Tue . "Packaging of electro-microfluidic devices". United States. https://www.osti.gov/servlets/purl/921326.
@article{osti_921326,
title = {Packaging of electro-microfluidic devices},
author = {Benavides, Gilbert L. and Galambos, Paul C. and Emerson, John A. and Peterson, Kenneth A. and Giunta, Rachel K. and Zamora, David Lee and Watson, Robert D.},
abstractNote = {A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2003},
month = {4}
}

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