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Title: Packaging of electro-microfluidic devices

Abstract

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Inventors:
 [1];  [1];  [1];  [1];  [1];  [1];  [2]
  1. Albuquerque, NM
  2. Tijeras, NM
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
921326
Patent Number(s):
6548895
Application Number:
09/790,305
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Benavides, Gilbert L, Galambos, Paul C, Emerson, John A, Peterson, Kenneth A, Giunta, Rachel K, Zamora, David Lee, and Watson, Robert D. Packaging of electro-microfluidic devices. United States: N. p., 2003. Web.
Benavides, Gilbert L, Galambos, Paul C, Emerson, John A, Peterson, Kenneth A, Giunta, Rachel K, Zamora, David Lee, & Watson, Robert D. Packaging of electro-microfluidic devices. United States.
Benavides, Gilbert L, Galambos, Paul C, Emerson, John A, Peterson, Kenneth A, Giunta, Rachel K, Zamora, David Lee, and Watson, Robert D. Tue . "Packaging of electro-microfluidic devices". United States. https://www.osti.gov/servlets/purl/921326.
@article{osti_921326,
title = {Packaging of electro-microfluidic devices},
author = {Benavides, Gilbert L and Galambos, Paul C and Emerson, John A and Peterson, Kenneth A and Giunta, Rachel K and Zamora, David Lee and Watson, Robert D},
abstractNote = {A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2003},
month = {4}
}

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Works referenced in this record:

Electroplated electro-fluidic interconnects for chemical sensors
journal, August 2000


Electrical and fluidic packaging of surface micromachined electromicrofluidic devices
conference, August 2000


Fluidic interconnects for modular assembly of chemical microsystems
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A new technology for fluidic microsystems based on PCB technology
journal, October 1999


An integrated liquid mixer/valve
journal, September 2000


A highly flexible design and production framework for modularized microelectromechanical systems
journal, March 1999


Low-cost plastic sensor packaging using the open-window package concept
journal, May 1998