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Title: Integration of planar transformer and/or planar inductor with power switches in power converter

Abstract

A power converter integrates at least one planar transformer comprising a multi-layer transformer substrate and/or at least one planar inductor comprising a multi-layer inductor substrate with a number of power semiconductor switches physically and thermally coupled to a heat sink via one or more multi-layer switch substrates.

Inventors:
 [1];  [1];  [1]
  1. Canton, MI
Issue Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
918896
Patent Number(s):
7289329
Application Number:
10/964,000
Assignee:
Siemens VDO Automotive Corporation (Auburn Hills, MI)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01F - MAGNETS
DOE Contract Number:  
AC05-00OR22725
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Chen, Kanghua, Ahmed, Sayeed, and Zhu, Lizhi. Integration of planar transformer and/or planar inductor with power switches in power converter. United States: N. p., 2007. Web.
Chen, Kanghua, Ahmed, Sayeed, & Zhu, Lizhi. Integration of planar transformer and/or planar inductor with power switches in power converter. United States.
Chen, Kanghua, Ahmed, Sayeed, and Zhu, Lizhi. Tue . "Integration of planar transformer and/or planar inductor with power switches in power converter". United States. https://www.osti.gov/servlets/purl/918896.
@article{osti_918896,
title = {Integration of planar transformer and/or planar inductor with power switches in power converter},
author = {Chen, Kanghua and Ahmed, Sayeed and Zhu, Lizhi},
abstractNote = {A power converter integrates at least one planar transformer comprising a multi-layer transformer substrate and/or at least one planar inductor comprising a multi-layer inductor substrate with a number of power semiconductor switches physically and thermally coupled to a heat sink via one or more multi-layer switch substrates.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2007},
month = {10}
}

Patent:

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Works referenced in this record:

Technology trends toward a system-in-a-module in power electronics
journal, January 2002


Improvement of transient response in high-current output DC-DC converters
conference, January 2003

  • Hirokawa, M.; Miyazaki, H.; Matsuura, K.
  • 18th Annual Applied Power Electronics Conference - APEC 2003, Eighteenth Annual IEEE Applied Power Electronics Conference and Exposition, 2003. APEC '03.
  • https://doi.org/10.1109/APEC.2003.1179291

Design and performance evaluation of low-voltage/high-current DC/DC on-board modules
conference, January 1999


Power electronic design and layout techniques for improved performance and reduced EMI
conference, January 1994