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Title: Wafer bonded virtual substrate and method for forming the same

Abstract

A method of forming a virtual substrate comprised of an optoelectronic device substrate and handle substrate comprises the steps of initiating bonding of the device substrate to the handle substrate, improving or increasing the mechanical strength of the device and handle substrates, and thinning the device substrate to leave a single-crystal film on the virtual substrate such as by exfoliation of a device film from the device substrate. The handle substrate is typically Si or other inexpensive common substrate material, while the optoelectronic device substrate is formed of more expensive and specialized electro-optic material. Using the methodology of the invention a wide variety of thin film electro-optic materials of high quality can be bonded to inexpensive substrates which serve as the mechanical support for an optoelectronic device layer fabricated in the thin film electro-optic material.

Inventors:
 [1];  [2];  [3]
  1. (So. Pasadena, CA)
  2. Pasadena, CA
  3. Paris, FR
Issue Date:
Research Org.:
Midwest Research Institute, Kansas City, MO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
913255
Patent Number(s):
7,238,622
Application Number:
10/761,918
Assignee:
California Institute of Technology (Pasadena, CA)
DOE Contract Number:  
AC36-99GO10337
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Atwater, Jr., Harry A., Zahler, James M, and Morral, Anna Fontcuberta i. Wafer bonded virtual substrate and method for forming the same. United States: N. p., 2007. Web.
Atwater, Jr., Harry A., Zahler, James M, & Morral, Anna Fontcuberta i. Wafer bonded virtual substrate and method for forming the same. United States.
Atwater, Jr., Harry A., Zahler, James M, and Morral, Anna Fontcuberta i. Tue . "Wafer bonded virtual substrate and method for forming the same". United States. https://www.osti.gov/servlets/purl/913255.
@article{osti_913255,
title = {Wafer bonded virtual substrate and method for forming the same},
author = {Atwater, Jr., Harry A. and Zahler, James M and Morral, Anna Fontcuberta i},
abstractNote = {A method of forming a virtual substrate comprised of an optoelectronic device substrate and handle substrate comprises the steps of initiating bonding of the device substrate to the handle substrate, improving or increasing the mechanical strength of the device and handle substrates, and thinning the device substrate to leave a single-crystal film on the virtual substrate such as by exfoliation of a device film from the device substrate. The handle substrate is typically Si or other inexpensive common substrate material, while the optoelectronic device substrate is formed of more expensive and specialized electro-optic material. Using the methodology of the invention a wide variety of thin film electro-optic materials of high quality can be bonded to inexpensive substrates which serve as the mechanical support for an optoelectronic device layer fabricated in the thin film electro-optic material.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2007},
month = {7}
}

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