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Title: System configured for applying a modifying agent to a non-equidimensional substrate

Abstract

The present invention is related to systems and methods for modifying various non-equidimensional substrates with modifying agents. The system comprises a processing chamber configured for passing the non-equidimensional substrate therethrough, wherein the processing chamber is further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber. The treatment mixture can comprise of the modifying agent in a carrier medium, wherein the carrier medium is selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas. Thus, the modifying agent can be applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.

Inventors:
;  [1];  [2];  [3];  [4];  [5];  [6];  [7];  [4]
  1. (Idaho Falls, ID), Argyle
  2. (Idaho Falls, ID), Fox
  3. (Idaho Falls, ID), Propp
  4. Idaho Falls, ID
  5. (Idaho Falls, ID), Ginosar
  6. (Idaho Falls, ID), Allen
  7. (Idaho Falls, ID), Miller
Issue Date:
Research Org.:
Idaho National Lab. (INL), Idaho Falls, ID (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
913242
Patent Number(s):
7241340
Application Number:
10/627,530
Assignee:
Battelle Energy Alliance, LLC (Idaho Falls, ID)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B05 - SPRAYING OR ATOMISING IN GENERAL B05D - PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D - TEXTILES D06 - TREATMENT OF TEXTILES OR THE LIKE D06B - TREATING TEXTILE MATERIALS USING LIQUIDS, GASES OR VAPOURS
DOE Contract Number:  
AC07-94ID13223; AC07-99ID13727; AC07-05ID14517
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Janikowski,, Stuart K., Mark D., Robert V., W Alan, Toth, William J., Daniel M., Charles A., and David, L. System configured for applying a modifying agent to a non-equidimensional substrate. United States: N. p., 2007. Web.
Janikowski,, Stuart K., Mark D., Robert V., W Alan, Toth, William J., Daniel M., Charles A., & David, L. System configured for applying a modifying agent to a non-equidimensional substrate. United States.
Janikowski,, Stuart K., Mark D., Robert V., W Alan, Toth, William J., Daniel M., Charles A., and David, L. Tue . "System configured for applying a modifying agent to a non-equidimensional substrate". United States. https://www.osti.gov/servlets/purl/913242.
@article{osti_913242,
title = {System configured for applying a modifying agent to a non-equidimensional substrate},
author = {Janikowski, and Stuart K. and Mark D. and Robert V. and W Alan, Toth and William J. and Daniel M. and Charles A. and David, L},
abstractNote = {The present invention is related to systems and methods for modifying various non-equidimensional substrates with modifying agents. The system comprises a processing chamber configured for passing the non-equidimensional substrate therethrough, wherein the processing chamber is further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber. The treatment mixture can comprise of the modifying agent in a carrier medium, wherein the carrier medium is selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas. Thus, the modifying agent can be applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2007},
month = {7}
}

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