System configured for applying a modifying agent to a non-equidimensional substrate
Abstract
The present invention is related to systems and methods for modifying various non-equidimensional substrates with modifying agents. The system comprises a processing chamber configured for passing the non-equidimensional substrate therethrough, wherein the processing chamber is further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber. The treatment mixture can comprise of the modifying agent in a carrier medium, wherein the carrier medium is selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas. Thus, the modifying agent can be applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.
- Inventors:
-
- (Idaho Falls, ID), Argyle
- (Idaho Falls, ID), Fox
- (Idaho Falls, ID), Propp
- Idaho Falls, ID
- (Idaho Falls, ID), Ginosar
- (Idaho Falls, ID), Allen
- (Idaho Falls, ID), Miller
- Issue Date:
- Research Org.:
- Idaho National Laboratory (INL), Idaho Falls, ID (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 913242
- Patent Number(s):
- 7241340
- Application Number:
- 10/627,530
- Assignee:
- Battelle Energy Alliance, LLC (Idaho Falls, ID)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B05 - SPRAYING OR ATOMISING IN GENERAL B05D - PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
C - CHEMISTRY C03 - GLASS C03C - CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS
- DOE Contract Number:
- AC07-94ID13223; AC07-99ID13727; AC07-05ID14517
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Janikowski,, Stuart K., Mark D., Robert V., W Alan, Toth, William J., Daniel M., Charles A., and David, L. System configured for applying a modifying agent to a non-equidimensional substrate. United States: N. p., 2007.
Web.
Janikowski,, Stuart K., Mark D., Robert V., W Alan, Toth, William J., Daniel M., Charles A., & David, L. System configured for applying a modifying agent to a non-equidimensional substrate. United States.
Janikowski,, Stuart K., Mark D., Robert V., W Alan, Toth, William J., Daniel M., Charles A., and David, L. Tue .
"System configured for applying a modifying agent to a non-equidimensional substrate". United States. https://www.osti.gov/servlets/purl/913242.
@article{osti_913242,
title = {System configured for applying a modifying agent to a non-equidimensional substrate},
author = {Janikowski, and Stuart K. and Mark D. and Robert V. and W Alan, Toth and William J. and Daniel M. and Charles A. and David, L},
abstractNote = {The present invention is related to systems and methods for modifying various non-equidimensional substrates with modifying agents. The system comprises a processing chamber configured for passing the non-equidimensional substrate therethrough, wherein the processing chamber is further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber. The treatment mixture can comprise of the modifying agent in a carrier medium, wherein the carrier medium is selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas. Thus, the modifying agent can be applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2007},
month = {7}
}