Conductive inks for metalization in integrated polymer microsystems

Davidson, James Courtney; Krulevitch, Peter A; Maghribi, Mariam N; Benett, William J; Hamilton, Julie K; Tovar, Armando R

Title: Conductive inks for metalization in integrated polymer microsystems

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Abstract

A system of metalization in an integrated polymer microsystem. A flexible polymer substrate is provided and conductive ink is applied to the substrate. In one embodiment the flexible polymer substrate is silicone. In another embodiment the flexible polymer substrate comprises poly(dimethylsiloxane).

Inventors:

Davidson, James Courtney ^[1]; Krulevitch, Peter A ^[2]; Maghribi, Mariam N ^[1]; Benett, William J ^[1]; Hamilton, Julie K ^[3]; Tovar, Armando R ^[4]

Livermore, CA
Pleasanton, CA
Tracy, CA
San Antonio, TX

Issue Date:: 2006-02-28

Research Org.:: Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 908589

Patent Number(s):: 7005179

Assignee:: The Regents of the University of California (Oakland, CA)

Patent Classifications (CPCs):: H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K1/032 - {consisting of one material}
H05K1/0283 - {Stretchable printed circuits}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L23/5387 - {Flexible insulating substrates
H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K1/0272 - {Adaptations for fluid transport, e.g. channels, holes}
H05K2203/0108 - Male die used for patterning, punching or transferring
H05K3/12 - using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L23/145 - {Organic substrates, e.g. plastic}

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S428/901 - Printed circuit

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K2203/082 - Suction, e.g. for holding solder balls or components
H05K2203/0126 - Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
H05K3/1258 - {by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern}

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T428/24917 - including metal layer

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K2201/0162 - Silicon containing polymer, e.g. silicone
H05K3/1275 - {by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing}
H05K3/1216 - {by screen printing or stencil printing}
H05K1/095 - {for polymer thick films, i.e. having a permanent organic polymeric binder}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L2924/1433 - Application-specific integrated circuit [ASIC]

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K3/101 - {by casting or moulding of conductive material}
H05K1/0393 - {Flexible materials

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DOE Contract Number:: W-7405-ENG-48

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE

Citation Formats


                    Davidson, James Courtney, Krulevitch, Peter A, Maghribi, Mariam N, Benett, William J, Hamilton, Julie K, and Tovar, Armando R. Conductive inks for metalization in integrated polymer microsystems.  United States: N. p., 2006. 
        Web.

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                    Davidson, James Courtney, Krulevitch, Peter A, Maghribi, Mariam N, Benett, William J, Hamilton, Julie K, & Tovar, Armando R. Conductive inks for metalization in integrated polymer microsystems.  United States.

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                    Davidson, James Courtney, Krulevitch, Peter A, Maghribi, Mariam N, Benett, William J, Hamilton, Julie K, and Tovar, Armando R. Tue .  
        "Conductive inks for metalization in integrated polymer microsystems".  United States.  https://www.osti.gov/servlets/purl/908589.

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@article{osti_908589,

  title        = {Conductive inks for metalization in integrated polymer microsystems},

  author       = {Davidson, James Courtney and Krulevitch, Peter A and Maghribi, Mariam N and Benett, William J and Hamilton, Julie K and Tovar, Armando R},

  abstractNote = {A system of metalization in an integrated polymer microsystem. A flexible polymer substrate is provided and conductive ink is applied to the substrate. In one embodiment the flexible polymer substrate is silicone. In another embodiment the flexible polymer substrate comprises poly(dimethylsiloxane).},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2006},

  month        = {2}

}

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