Method of defining features on materials with a femtosecond laser
Abstract
The invention relates to a pulsed laser ablation method of metals and/or dielectric films from the surface of a wafer, printed circuit board or a hybrid substrate. By utilizing a high-energy ultra-short pulses of laser light, such a method can be used to manufacture electronic circuits and/or electro-mechanical assemblies without affecting the material adjacent to the ablation zone.
- Inventors:
-
- Los Altos, CA
- Livermore, CA
- Issue Date:
- Research Org.:
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 908416
- Patent Number(s):
- 7049543
- Application Number:
- 10/704,459
- Assignee:
- The Regents of the University of California (Oakland, CA)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
- DOE Contract Number:
- W-7405-ENG-48
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Roos, Edward Victor, Roeske, Franklin, Lee, Ronald S, and Benterou, Jerry J. Method of defining features on materials with a femtosecond laser. United States: N. p., 2006.
Web.
Roos, Edward Victor, Roeske, Franklin, Lee, Ronald S, & Benterou, Jerry J. Method of defining features on materials with a femtosecond laser. United States.
Roos, Edward Victor, Roeske, Franklin, Lee, Ronald S, and Benterou, Jerry J. Tue .
"Method of defining features on materials with a femtosecond laser". United States. https://www.osti.gov/servlets/purl/908416.
@article{osti_908416,
title = {Method of defining features on materials with a femtosecond laser},
author = {Roos, Edward Victor and Roeske, Franklin and Lee, Ronald S and Benterou, Jerry J},
abstractNote = {The invention relates to a pulsed laser ablation method of metals and/or dielectric films from the surface of a wafer, printed circuit board or a hybrid substrate. By utilizing a high-energy ultra-short pulses of laser light, such a method can be used to manufacture electronic circuits and/or electro-mechanical assemblies without affecting the material adjacent to the ablation zone.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2006},
month = {5}
}