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Title: Method of defining features on materials with a femtosecond laser

Abstract

The invention relates to a pulsed laser ablation method of metals and/or dielectric films from the surface of a wafer, printed circuit board or a hybrid substrate. By utilizing a high-energy ultra-short pulses of laser light, such a method can be used to manufacture electronic circuits and/or electro-mechanical assemblies without affecting the material adjacent to the ablation zone.

Inventors:
 [1];  [2];  [2];  [2]
  1. Los Altos, CA
  2. Livermore, CA
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
908416
Patent Number(s):
7049543
Application Number:
10/704,459
Assignee:
The Regents of the University of California (Oakland, CA)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Roos, Edward Victor, Roeske, Franklin, Lee, Ronald S, and Benterou, Jerry J. Method of defining features on materials with a femtosecond laser. United States: N. p., 2006. Web.
Roos, Edward Victor, Roeske, Franklin, Lee, Ronald S, & Benterou, Jerry J. Method of defining features on materials with a femtosecond laser. United States.
Roos, Edward Victor, Roeske, Franklin, Lee, Ronald S, and Benterou, Jerry J. Tue . "Method of defining features on materials with a femtosecond laser". United States. https://www.osti.gov/servlets/purl/908416.
@article{osti_908416,
title = {Method of defining features on materials with a femtosecond laser},
author = {Roos, Edward Victor and Roeske, Franklin and Lee, Ronald S and Benterou, Jerry J},
abstractNote = {The invention relates to a pulsed laser ablation method of metals and/or dielectric films from the surface of a wafer, printed circuit board or a hybrid substrate. By utilizing a high-energy ultra-short pulses of laser light, such a method can be used to manufacture electronic circuits and/or electro-mechanical assemblies without affecting the material adjacent to the ablation zone.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2006},
month = {5}
}