Compliant cantilevered micromold
Abstract
A compliant cantilevered three-dimensional micromold is provided. The compliant cantilevered micromold is suitable for use in the replication of cantilevered microparts and greatly simplifies the replication of such cantilevered parts. The compliant cantilevered micromold may be used to fabricate microparts using casting or electroforming techniques. When the compliant micromold is used to fabricate electroformed cantilevered parts, the micromold will also comprise an electrically conducting base formed by a porous metal substrate that is embedded within the compliant cantilevered micromold. Methods for fabricating the compliant cantilevered micromold as well as methods of replicating cantilevered microparts using the compliant cantilevered micromold are also provided.
- Inventors:
-
- Pleasanton, CA
- Danville, CA
- Seattle, WA
- Livermore, CA
- Albuquerque, NM
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-CA), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 908276
- Patent Number(s):
- 7090189
- Application Number:
- 10/222,763
- Assignee:
- Sandia National Laboratories (Livermore, CA)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B29 - WORKING OF PLASTICS B29C - SHAPING OR JOINING OF PLASTICS
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Morales, Alfredo Martin, Domeier, Linda A, Gonzales, Marcela G, Keifer, Patrick N, and Garino, Terry Joseph. Compliant cantilevered micromold. United States: N. p., 2006.
Web.
Morales, Alfredo Martin, Domeier, Linda A, Gonzales, Marcela G, Keifer, Patrick N, & Garino, Terry Joseph. Compliant cantilevered micromold. United States.
Morales, Alfredo Martin, Domeier, Linda A, Gonzales, Marcela G, Keifer, Patrick N, and Garino, Terry Joseph. Tue .
"Compliant cantilevered micromold". United States. https://www.osti.gov/servlets/purl/908276.
@article{osti_908276,
title = {Compliant cantilevered micromold},
author = {Morales, Alfredo Martin and Domeier, Linda A and Gonzales, Marcela G and Keifer, Patrick N and Garino, Terry Joseph},
abstractNote = {A compliant cantilevered three-dimensional micromold is provided. The compliant cantilevered micromold is suitable for use in the replication of cantilevered microparts and greatly simplifies the replication of such cantilevered parts. The compliant cantilevered micromold may be used to fabricate microparts using casting or electroforming techniques. When the compliant micromold is used to fabricate electroformed cantilevered parts, the micromold will also comprise an electrically conducting base formed by a porous metal substrate that is embedded within the compliant cantilevered micromold. Methods for fabricating the compliant cantilevered micromold as well as methods of replicating cantilevered microparts using the compliant cantilevered micromold are also provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2006},
month = {8}
}
Works referenced in this record:
Various replication techniques for manufacturing three-dimensional metal microstructures
journal, December 1997
- Ruprecht, R.; Benzler, T.; Hanemann, T.
- Microsystem Technologies, Vol. 4, Issue 1
Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process)
journal, May 1986
- Becker, E. W.; Ehrfeld, W.; Hagmann, P.
- Microelectronic Engineering, Vol. 4, Issue 1, p. 35-56
Molding of three dimensional microstructures by the LIGA process
conference, January 1992
- Harmening, M.; Bacher, W.; Bley, P.
- [1992] Proceedings IEEE Micro Electro Mechanical Systems
Molding of LIGA microstructures from fluorinated polymers
journal, October 1996
- Ruprecht, R.; Kalb, H.; Kowanz, B.
- Microsystem Technologies, Vol. 2, Issue 4