Programmable Multi-Chip Module
Abstract
A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.
- Inventors:
-
- Lenexa, KS
- Lee's Summit, MO
- Overland Park, KS
- Issue Date:
- Research Org.:
- Kansas City Plant (KCP), Kansas City, MO (United States)
- OSTI Identifier:
- 880244
- Patent Number(s):
- 6897078
- Application Number:
- 10/697898
- Assignee:
- Honeywell Federal Manufacturing & Technologies (Kansas City, MO)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- AC04-01AL66850
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Kautz, David, Morgenstern, Howard, and Blazek, Roy J. Programmable Multi-Chip Module. United States: N. p., 2005.
Web.
Kautz, David, Morgenstern, Howard, & Blazek, Roy J. Programmable Multi-Chip Module. United States.
Kautz, David, Morgenstern, Howard, and Blazek, Roy J. Tue .
"Programmable Multi-Chip Module". United States. https://www.osti.gov/servlets/purl/880244.
@article{osti_880244,
title = {Programmable Multi-Chip Module},
author = {Kautz, David and Morgenstern, Howard and Blazek, Roy J},
abstractNote = {A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2005},
month = {5}
}
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Works referenced in this record:
Design and development challenges for complex laminate multichip modules
conference, January 1997
- Cotton, C. D.; Kling, D. R.; Sebesta, G.
- Proceedings 1997 International Conference on Multichip Modules