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Title: Programmable Multi-Chip Module

Abstract

A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.

Inventors:
 [1];  [2];  [3]
  1. Lenexa, KS
  2. Lee's Summit, MO
  3. Overland Park, KS
Issue Date:
Research Org.:
Kansas City Plant (KCP), Kansas City, MO (United States)
OSTI Identifier:
880244
Patent Number(s):
6897078
Application Number:
10/697898
Assignee:
Honeywell Federal Manufacturing & Technologies (Kansas City, MO)
Patent Classifications (CPCs):
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
AC04-01AL66850
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Kautz, David, Morgenstern, Howard, and Blazek, Roy J. Programmable Multi-Chip Module. United States: N. p., 2005. Web.
Kautz, David, Morgenstern, Howard, & Blazek, Roy J. Programmable Multi-Chip Module. United States.
Kautz, David, Morgenstern, Howard, and Blazek, Roy J. Tue . "Programmable Multi-Chip Module". United States. https://www.osti.gov/servlets/purl/880244.
@article{osti_880244,
title = {Programmable Multi-Chip Module},
author = {Kautz, David and Morgenstern, Howard and Blazek, Roy J},
abstractNote = {A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2005},
month = {5}
}

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Works referenced in this record:

Design and development challenges for complex laminate multichip modules
conference, January 1997