Multilayered Microelectronic Device Package With An Integral Window
Abstract
A microelectronic package with an integral window mounted in a recessed lip for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can be formed of a low temperature co-fired ceramic (LTCC) or high temperature cofired ceramic (HTCC) multilayered material, with the integral window being simultaneously joined (e.g. co-fired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that a light-sensitive side is optically accessible through the window. The result is a compact, low profile package, having an integral window mounted in a recessed lip, that can be hermetically sealed.
- Inventors:
-
- Albuquerque, NM
- Tijeras, NM
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- OSTI Identifier:
- 880005
- Patent Number(s):
- 6809413
- Application Number:
- 10/422418
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81B - MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Peterson, Kenneth A, and Watson, Robert D. Multilayered Microelectronic Device Package With An Integral Window. United States: N. p., 2004.
Web.
Peterson, Kenneth A, & Watson, Robert D. Multilayered Microelectronic Device Package With An Integral Window. United States.
Peterson, Kenneth A, and Watson, Robert D. Tue .
"Multilayered Microelectronic Device Package With An Integral Window". United States. https://www.osti.gov/servlets/purl/880005.
@article{osti_880005,
title = {Multilayered Microelectronic Device Package With An Integral Window},
author = {Peterson, Kenneth A and Watson, Robert D},
abstractNote = {A microelectronic package with an integral window mounted in a recessed lip for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can be formed of a low temperature co-fired ceramic (LTCC) or high temperature cofired ceramic (HTCC) multilayered material, with the integral window being simultaneously joined (e.g. co-fired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that a light-sensitive side is optically accessible through the window. The result is a compact, low profile package, having an integral window mounted in a recessed lip, that can be hermetically sealed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Oct 26 00:00:00 EDT 2004},
month = {Tue Oct 26 00:00:00 EDT 2004}
}