Method of making an icosahedral boride structure
Abstract
A method for fabricating thin films of an icosahedral boride on a silicon carbide (SiC) substrate is provided. Preferably the icosahedral boride layer is comprised of either boron phosphide (B.sub.12 P.sub.2) or boron arsenide (B.sub.12 As.sub.2). The provided method achieves improved film crystallinity and lowered impurity concentrations. In one aspect, an epitaxially grown layer of B.sub.12 P.sub.2 with a base layer or substrate of SiC is provided. In another aspect, an epitaxially grown layer of B.sub.12 As.sub.2 with a base layer or substrate of SiC is provided. In yet another aspect, thin films of B.sub.12 P.sub.2 or B.sub.12 As.sub.2 are formed on SiC using CVD or other vapor deposition means. If CVD techniques are employed, preferably the deposition temperature is above 1050.degree. C., more preferably in the range of 1100.degree. C. to 1400.degree. C., and still more preferably approximately 1150.degree. C.
- Inventors:
-
- 3712 Silver Ave. SE., Albuquerque, NM 87108
- 939 Buena Vista Dr., SE., Apt. F203, Albuquerque, NM 87106
- 4409 Buckingham Dr., El Paso, TX 79902
- 62 Avenida Del Sol, Cedar Crest, NM 87008
- 1502 Harvard Ct. NE., Albuquerque, NM 87106
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- OSTI Identifier:
- 879999
- Patent Number(s):
- 6841456
- Application Number:
- 10/418018
- Assignee:
- OSTI
- Patent Classifications (CPCs):
-
G - PHYSICS G21 - NUCLEAR PHYSICS G21H - OBTAINING ENERGY FROM RADIOACTIVE SOURCES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Hersee, Stephen D, Wang, Ronghua, Zubia, David, Aselage, Terrance L, and Emin, David. Method of making an icosahedral boride structure. United States: N. p., 2005.
Web.
Hersee, Stephen D, Wang, Ronghua, Zubia, David, Aselage, Terrance L, & Emin, David. Method of making an icosahedral boride structure. United States.
Hersee, Stephen D, Wang, Ronghua, Zubia, David, Aselage, Terrance L, and Emin, David. Tue .
"Method of making an icosahedral boride structure". United States. https://www.osti.gov/servlets/purl/879999.
@article{osti_879999,
title = {Method of making an icosahedral boride structure},
author = {Hersee, Stephen D and Wang, Ronghua and Zubia, David and Aselage, Terrance L and Emin, David},
abstractNote = {A method for fabricating thin films of an icosahedral boride on a silicon carbide (SiC) substrate is provided. Preferably the icosahedral boride layer is comprised of either boron phosphide (B.sub.12 P.sub.2) or boron arsenide (B.sub.12 As.sub.2). The provided method achieves improved film crystallinity and lowered impurity concentrations. In one aspect, an epitaxially grown layer of B.sub.12 P.sub.2 with a base layer or substrate of SiC is provided. In another aspect, an epitaxially grown layer of B.sub.12 As.sub.2 with a base layer or substrate of SiC is provided. In yet another aspect, thin films of B.sub.12 P.sub.2 or B.sub.12 As.sub.2 are formed on SiC using CVD or other vapor deposition means. If CVD techniques are employed, preferably the deposition temperature is above 1050.degree. C., more preferably in the range of 1100.degree. C. to 1400.degree. C., and still more preferably approximately 1150.degree. C.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2005},
month = {1}
}
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