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Title: Method Of Packaging And Assembling Electro-Microfluidic Devices

Abstract

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Inventors:
 [1];  [1];  [1];  [1];  [1];  [1];  [2]
  1. Albuquerque, NM
  2. Tijeras, NM
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
879946
Patent Number(s):
6821819
Application Number:
10/370543
Assignee:
Sandia Corporation (Albuquerque, MN)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Benavides, Gilbert L, Galambos, Paul C, Emerson, John A, Peterson, Kenneth A, Giunta, Rachel K, Zamora, David Lee, and Watson, Robert D. Method Of Packaging And Assembling Electro-Microfluidic Devices. United States: N. p., 2004. Web.
Benavides, Gilbert L, Galambos, Paul C, Emerson, John A, Peterson, Kenneth A, Giunta, Rachel K, Zamora, David Lee, & Watson, Robert D. Method Of Packaging And Assembling Electro-Microfluidic Devices. United States.
Benavides, Gilbert L, Galambos, Paul C, Emerson, John A, Peterson, Kenneth A, Giunta, Rachel K, Zamora, David Lee, and Watson, Robert D. Tue . "Method Of Packaging And Assembling Electro-Microfluidic Devices". United States. https://www.osti.gov/servlets/purl/879946.
@article{osti_879946,
title = {Method Of Packaging And Assembling Electro-Microfluidic Devices},
author = {Benavides, Gilbert L and Galambos, Paul C and Emerson, John A and Peterson, Kenneth A and Giunta, Rachel K and Zamora, David Lee and Watson, Robert D},
abstractNote = {A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2004},
month = {11}
}

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