Processing A Printed Wiring Board By Single Bath Electrodeposition

Title: Processing A Printed Wiring Board By Single Bath Electrodeposition

Abstract

A method of processing a printed wiring board by single bath electrodeposition. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from the bath containing nickel and copper and final processing steps are implemented on the printed wiring board.

Inventors:

Meltzer, Michael P ^[1]; Steffani, Christopher P ^[2]; Gonfiotti, Ray A ^[2]

Oakland, CA
Livermore, CA

Issue Date:: 2003-04-15

Research Org.:: Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

OSTI Identifier:: 879696

Patent Number(s):: 6547946

Application Number:: 09/810877

Assignee:: The Regents of the University of California (Oakland, CA)

Patent Classifications (CPCs):: H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS

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H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K3/062 - {consisting of metals or alloys or metallic inorganic compounds
H05K3/244 - {Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
C25D5/12 - at least one layer being of nickel or chromium
C25D3/562 - {containing more than 50% by weight of iron or nickel or cobalt
C25D3/58 - containing more than 50% by weight of copper

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T428/24917 - including metal layer

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DOE Contract Number:: W-7405-ENG-48

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Citation Formats


                    Meltzer, Michael P, Steffani, Christopher P, and Gonfiotti, Ray A. Processing A Printed Wiring Board By Single Bath Electrodeposition.  United States: N. p., 2003. 
        Web.

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                    Meltzer, Michael P, Steffani, Christopher P, & Gonfiotti, Ray A. Processing A Printed Wiring Board By Single Bath Electrodeposition.  United States.

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                    Meltzer, Michael P, Steffani, Christopher P, and Gonfiotti, Ray A. Tue .  
        "Processing A Printed Wiring Board By Single Bath Electrodeposition".  United States.  https://www.osti.gov/servlets/purl/879696.

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@article{osti_879696,

  title        = {Processing A Printed Wiring Board By Single Bath Electrodeposition},

  author       = {Meltzer, Michael P and Steffani, Christopher P and Gonfiotti, Ray A},

  abstractNote = {A method of processing a printed wiring board by single bath electrodeposition. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from the bath containing nickel and copper and final processing steps are implemented on the printed wiring board.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2003},

  month        = {4}

}

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Works referenced in this record:

Electrochemical Formation of Laminar Deposits of Controlled Structure and Composition: II . Dual Current Pulse Galvanostatic Technique
journal, June 1989

Despić, A. R.; Jović, V. D.; Spaić, S.
Journal of The Electrochemical Society, Vol. 136, Issue 6
https://doi.org/10.1149/1.2096987

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Title: Processing A Printed Wiring Board By Single Bath Electrodeposition

Abstract

Citation Formats

Electrochemical Formation of Laminar Deposits of Controlled Structure and Composition: II . Dual Current Pulse Galvanostatic Technique journal, June 1989

Electrochemical Formation of Laminar Deposits of Controlled Structure and Composition: II . Dual Current Pulse Galvanostatic Technique
journal, June 1989