skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Processing A Printed Wiring Board By Single Bath Electrodeposition

Abstract

A method of processing a printed wiring board by single bath electrodeposition. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from the bath containing nickel and copper and final processing steps are implemented on the printed wiring board.

Inventors:
 [1];  [2];  [2]
  1. Oakland, CA
  2. Livermore, CA
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
OSTI Identifier:
879696
Patent Number(s):
6547946
Application Number:
09/810877
Assignee:
The Regents of the University of California (Oakland, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Meltzer, Michael P, Steffani, Christopher P, and Gonfiotti, Ray A. Processing A Printed Wiring Board By Single Bath Electrodeposition. United States: N. p., 2003. Web.
Meltzer, Michael P, Steffani, Christopher P, & Gonfiotti, Ray A. Processing A Printed Wiring Board By Single Bath Electrodeposition. United States.
Meltzer, Michael P, Steffani, Christopher P, and Gonfiotti, Ray A. Tue . "Processing A Printed Wiring Board By Single Bath Electrodeposition". United States. https://www.osti.gov/servlets/purl/879696.
@article{osti_879696,
title = {Processing A Printed Wiring Board By Single Bath Electrodeposition},
author = {Meltzer, Michael P and Steffani, Christopher P and Gonfiotti, Ray A},
abstractNote = {A method of processing a printed wiring board by single bath electrodeposition. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from the bath containing nickel and copper and final processing steps are implemented on the printed wiring board.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2003},
month = {4}
}

Patent:

Save / Share:

Works referenced in this record:

Electrochemical Formation of Laminar Deposits of Controlled Structure and Composition: II . Dual Current Pulse Galvanostatic Technique
journal, June 1989