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Title: Processing A Printed Wiring Board By Single Bath Electrodeposition

Abstract

A method of processing a printed wiring board by single bath electrodeposition. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from the bath containing nickel and copper and final processing steps are implemented on the printed wiring board.

Inventors:
 [1];  [2];  [2]
  1. (Oakland, CA)
  2. (Livermore, CA)
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
OSTI Identifier:
879696
Patent Number(s):
6547946
Application Number:
09/810877
Assignee:
The Regents of the University of California (Oakland, CA) OSTI
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Meltzer, Michael P., Steffani, Christopher P., and Gonfiotti, Ray A. Processing A Printed Wiring Board By Single Bath Electrodeposition. United States: N. p., 2003. Web.
Meltzer, Michael P., Steffani, Christopher P., & Gonfiotti, Ray A. Processing A Printed Wiring Board By Single Bath Electrodeposition. United States.
Meltzer, Michael P., Steffani, Christopher P., and Gonfiotti, Ray A. Tue . "Processing A Printed Wiring Board By Single Bath Electrodeposition". United States. https://www.osti.gov/servlets/purl/879696.
@article{osti_879696,
title = {Processing A Printed Wiring Board By Single Bath Electrodeposition},
author = {Meltzer, Michael P. and Steffani, Christopher P. and Gonfiotti, Ray A.},
abstractNote = {A method of processing a printed wiring board by single bath electrodeposition. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from the bath containing nickel and copper and final processing steps are implemented on the printed wiring board.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2003},
month = {4}
}

Patent:

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