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Title: Optoelectronic Mounting Structure

Abstract

An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the heat spreader. Optoelectronic devices may be adapted to the heat spreader in such a manner that the devices are accessible through the window in the mounting structure.

Inventors:
 [1];  [1];  [1];  [1];  [1];  [1];  [2];  [1];  [3];  [1];  [4];  [5]
  1. Albuquerque, NM
  2. (Albuquerque, NM)
  3. Sandia Park, NM
  4. Corrales, NM
  5. Lafayette, CO
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
879685
Patent Number(s):
6799902
Application Number:
09/749283
Assignee:
Emcore Corporation (Somerset, NJ)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Anderson, Gene R, Armendariz, Marcelino G, Baca, Johnny R. F., Bryan, Robert P, Carson, Richard F, Chu, Dahwey, Duckett, III, Edwin B., McCormick, Frederick B, Peterson, David W, Peterson, Gary D, Reber, Cathleen A, and Reysen, Bill H. Optoelectronic Mounting Structure. United States: N. p., 2004. Web.
Anderson, Gene R, Armendariz, Marcelino G, Baca, Johnny R. F., Bryan, Robert P, Carson, Richard F, Chu, Dahwey, Duckett, III, Edwin B., McCormick, Frederick B, Peterson, David W, Peterson, Gary D, Reber, Cathleen A, & Reysen, Bill H. Optoelectronic Mounting Structure. United States.
Anderson, Gene R, Armendariz, Marcelino G, Baca, Johnny R. F., Bryan, Robert P, Carson, Richard F, Chu, Dahwey, Duckett, III, Edwin B., McCormick, Frederick B, Peterson, David W, Peterson, Gary D, Reber, Cathleen A, and Reysen, Bill H. Tue . "Optoelectronic Mounting Structure". United States. https://www.osti.gov/servlets/purl/879685.
@article{osti_879685,
title = {Optoelectronic Mounting Structure},
author = {Anderson, Gene R and Armendariz, Marcelino G and Baca, Johnny R. F. and Bryan, Robert P and Carson, Richard F and Chu, Dahwey and Duckett, III, Edwin B. and McCormick, Frederick B and Peterson, David W and Peterson, Gary D and Reber, Cathleen A and Reysen, Bill H},
abstractNote = {An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the heat spreader. Optoelectronic devices may be adapted to the heat spreader in such a manner that the devices are accessible through the window in the mounting structure.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2004},
month = {10}
}

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Works referenced in this record:

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