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Title: Alignment Systems For Subassemblies Of Overmolded Optoeletronic Modules

Abstract

Alignment systems for optoelectronic modules with overmolded chip carriers include drilled or milled substrate corners for engaging dowel pins to precisely align the substrate in a mold for molding an overmold frame on the substrate. The overmold frame includes slot and trilobe holes for receiving retainer posts to precisely align a retainer assembly on the overmold frame. Cooperating standoff pads on the overmold frame and on the retainer assembly stabilize the assembly of these components and provide a precise gap for receiving an adhesive to permanently attach these two components. The retainer assembly carries optoelectronic components that include a flexible circuit, and a distal end portion of this flexible circuit and walls of a receiving cavity in the overmold frame have cooperating features for precisely aligning distal electrical leads of the flexible circuit with an array of electrical pads on the substrate. A permanent shroud on a proximate end portion of the flexible circuit protects and helps align proximate electrical leads with electrical pads on optic dies and their carriers.

Inventors:
 [1];  [2];  [3];  [4];  [5];  [6];  [5]
  1. Vestal, NY
  2. Richelieu, CA
  3. Stukely-Sud, CA
  4. Yorktown Heights, NY
  5. Granby, CA
  6. Lisle, NY
Issue Date:
OSTI Identifier:
879650
Patent Number(s):
6547452
Application Number:
09/568978
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Classifications (CPCs):
G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
B - PERFORMING OPERATIONS B29 - WORKING OF PLASTICS B29C - SHAPING OR JOINING OF PLASTICS
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Chan, Benson, Fortier, Paul F, Guindon, Francois M, Johnson, Glen W, Letourneau, Martial A, Sherman, John H, and Tetreault, Real. Alignment Systems For Subassemblies Of Overmolded Optoeletronic Modules. United States: N. p., 2003. Web.
Chan, Benson, Fortier, Paul F, Guindon, Francois M, Johnson, Glen W, Letourneau, Martial A, Sherman, John H, & Tetreault, Real. Alignment Systems For Subassemblies Of Overmolded Optoeletronic Modules. United States.
Chan, Benson, Fortier, Paul F, Guindon, Francois M, Johnson, Glen W, Letourneau, Martial A, Sherman, John H, and Tetreault, Real. Tue . "Alignment Systems For Subassemblies Of Overmolded Optoeletronic Modules". United States. https://www.osti.gov/servlets/purl/879650.
@article{osti_879650,
title = {Alignment Systems For Subassemblies Of Overmolded Optoeletronic Modules},
author = {Chan, Benson and Fortier, Paul F and Guindon, Francois M and Johnson, Glen W and Letourneau, Martial A and Sherman, John H and Tetreault, Real},
abstractNote = {Alignment systems for optoelectronic modules with overmolded chip carriers include drilled or milled substrate corners for engaging dowel pins to precisely align the substrate in a mold for molding an overmold frame on the substrate. The overmold frame includes slot and trilobe holes for receiving retainer posts to precisely align a retainer assembly on the overmold frame. Cooperating standoff pads on the overmold frame and on the retainer assembly stabilize the assembly of these components and provide a precise gap for receiving an adhesive to permanently attach these two components. The retainer assembly carries optoelectronic components that include a flexible circuit, and a distal end portion of this flexible circuit and walls of a receiving cavity in the overmold frame have cooperating features for precisely aligning distal electrical leads of the flexible circuit with an array of electrical pads on the substrate. A permanent shroud on a proximate end portion of the flexible circuit protects and helps align proximate electrical leads with electrical pads on optic dies and their carriers.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2003},
month = {4}
}

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