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Title: Method For Making Electronic Circuits Having Nial And Ni3al Substrates

Abstract

A method for making electronic circuit component having improved mechanical properties and thermal conductivity comprises steps of providing NiAl and/or Ni.sub.3 Al, and forming an alumina layer thereupon prior to applying the conductive elements. Additional layers of copper-aluminum alloy or copper further improve mechanical strength and thermal conductivity.

Inventors:
 [1];  [2]
  1. (Midlothian, VA)
  2. (Oak Ridge, TN)
Issue Date:
Research Org.:
LOCKHEED MARTIN ENRGY SYST INC
OSTI Identifier:
879577
Patent Number(s):
6,179,953
Application Number:
09/260124
Assignee:
UT-Battelle, LLC (Oak Ridge, TN) OSTI
DOE Contract Number:  
AC05-84OR21400
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Deevi, Seetharama C., and Sikka, Vinod K. Method For Making Electronic Circuits Having Nial And Ni3al Substrates. United States: N. p., 2001. Web.
Deevi, Seetharama C., & Sikka, Vinod K. Method For Making Electronic Circuits Having Nial And Ni3al Substrates. United States.
Deevi, Seetharama C., and Sikka, Vinod K. Tue . "Method For Making Electronic Circuits Having Nial And Ni3al Substrates". United States. https://www.osti.gov/servlets/purl/879577.
@article{osti_879577,
title = {Method For Making Electronic Circuits Having Nial And Ni3al Substrates},
author = {Deevi, Seetharama C. and Sikka, Vinod K.},
abstractNote = {A method for making electronic circuit component having improved mechanical properties and thermal conductivity comprises steps of providing NiAl and/or Ni.sub.3 Al, and forming an alumina layer thereupon prior to applying the conductive elements. Additional layers of copper-aluminum alloy or copper further improve mechanical strength and thermal conductivity.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2001},
month = {1}
}

Patent:

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