Multilayered microelectronic device package with an integral window
Abstract
An apparatus for packaging of microelectronic devices is disclosed, wherein the package includes an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can comprise, for example, a cofired ceramic frame or body. The package has an internal stepped structure made of a plurality of plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package, according to some embodiments. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the numbermore »
- Inventors:
-
- Albuquerque, NM
- Tijeras, NM
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- OSTI Identifier:
- 875129
- Patent Number(s):
- 6538312
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81B - MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- multilayered; microelectronic; device; package; integral; window; apparatus; packaging; devices; disclosed; semiconductor; chip; ccd; cmos; vcsel; laser; diode; mems; imems; example; cofired; ceramic; frame; internal; stepped; structure; plurality; plates; apertures; patterned; metallized; conductive; circuit; traces; flip-chip; bonded; plate; oriented; light-sensitive; optically; accessible; cover; lid; attached; opposite; result; compact; low-profile; hermetically-sealed; formed; low-temperature; ltcc; high-temperature; htcc; multilayer; processes; simultaneously; joined; processing; multiple; chips; located; single; embodiments; suited; handling; steps; greatly; reduced; reducing; potential; contamination; lens; transforming; light; passing; array; binary; optic; lenslets; electrically-switched; optical; modulator; lithium; niobate; providing; fast; electrically-operated; shutter; laser diode; light passing; semiconductor chip; electronic device; /257/
Citation Formats
Peterson, Kenneth A, and Watson, Robert D. Multilayered microelectronic device package with an integral window. United States: N. p., 2003.
Web.
Peterson, Kenneth A, & Watson, Robert D. Multilayered microelectronic device package with an integral window. United States.
Peterson, Kenneth A, and Watson, Robert D. Wed .
"Multilayered microelectronic device package with an integral window". United States. https://www.osti.gov/servlets/purl/875129.
@article{osti_875129,
title = {Multilayered microelectronic device package with an integral window},
author = {Peterson, Kenneth A and Watson, Robert D},
abstractNote = {An apparatus for packaging of microelectronic devices is disclosed, wherein the package includes an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can comprise, for example, a cofired ceramic frame or body. The package has an internal stepped structure made of a plurality of plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package, according to some embodiments. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the number of handling steps is greatly reduced, thereby reducing the potential for contamination. The integral window can further include a lens for optically transforming light passing through the window. The package can include an array of binary optic lenslets made integral with the window. The package can include an electrically-switched optical modulator, such as a lithium niobate window attached to the package, for providing a very fast electrically-operated shutter.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Wed Jan 01 00:00:00 EST 2003},
month = {Wed Jan 01 00:00:00 EST 2003}
}