skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Method of fabricating a microelectronic device package with an integral window

Abstract

A method of fabricating a microelectronic device package with an integral window for providing optical access through an aperture in the package. The package is made of a multilayered insulating material, e.g., a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC). The window is inserted in-between personalized layers of ceramic green tape during stackup and registration. Then, during baking and firing, the integral window is simultaneously bonded to the sintered ceramic layers of the densified package. Next, the microelectronic device is flip-chip bonded to cofired thick-film metallized traces on the package, where the light-sensitive side is optically accessible through the window. Finally, a cover lid is attached to the opposite side of the package. The result is a compact, low-profile package, flip-chip bonded, hermetically-sealed package having an integral window.

Inventors:
 [1];  [2]
  1. (Albuquerque, NM)
  2. (Tijeras, NM)
Issue Date:
Research Org.:
SANDIA CORP
OSTI Identifier:
875100
Patent Number(s):
6531341
Assignee:
Sandia Corporation (Albuquerque, NM) SNL
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
method; fabricating; microelectronic; device; package; integral; window; providing; optical; access; aperture; multilayered; insulating; material; low-temperature; cofired; ceramic; ltcc; high-temperature; htcc; inserted; in-between; personalized; layers; green; tape; stackup; registration; baking; firing; simultaneously; bonded; sintered; densified; flip-chip; thick-film; metallized; traces; light-sensitive; optically; accessible; finally; cover; lid; attached; opposite; result; compact; low-profile; hermetically-sealed; ceramic layer; optical access; electronic device; /438/257/

Citation Formats

Peterson, Kenneth A., and Watson, Robert D. Method of fabricating a microelectronic device package with an integral window. United States: N. p., 2003. Web.
Peterson, Kenneth A., & Watson, Robert D. Method of fabricating a microelectronic device package with an integral window. United States.
Peterson, Kenneth A., and Watson, Robert D. Wed . "Method of fabricating a microelectronic device package with an integral window". United States. https://www.osti.gov/servlets/purl/875100.
@article{osti_875100,
title = {Method of fabricating a microelectronic device package with an integral window},
author = {Peterson, Kenneth A. and Watson, Robert D.},
abstractNote = {A method of fabricating a microelectronic device package with an integral window for providing optical access through an aperture in the package. The package is made of a multilayered insulating material, e.g., a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC). The window is inserted in-between personalized layers of ceramic green tape during stackup and registration. Then, during baking and firing, the integral window is simultaneously bonded to the sintered ceramic layers of the densified package. Next, the microelectronic device is flip-chip bonded to cofired thick-film metallized traces on the package, where the light-sensitive side is optically accessible through the window. Finally, a cover lid is attached to the opposite side of the package. The result is a compact, low-profile package, flip-chip bonded, hermetically-sealed package having an integral window.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2003},
month = {1}
}

Patent:

Save / Share: