Method of fabricating a microelectronic device package with an integral window
Abstract
A method of fabricating a microelectronic device package with an integral window for providing optical access through an aperture in the package. The package is made of a multilayered insulating material, e.g., a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC). The window is inserted in-between personalized layers of ceramic green tape during stackup and registration. Then, during baking and firing, the integral window is simultaneously bonded to the sintered ceramic layers of the densified package. Next, the microelectronic device is flip-chip bonded to cofired thick-film metallized traces on the package, where the light-sensitive side is optically accessible through the window. Finally, a cover lid is attached to the opposite side of the package. The result is a compact, low-profile package, flip-chip bonded, hermetically-sealed package having an integral window.
- Inventors:
-
- Albuquerque, NM
- Tijeras, NM
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- OSTI Identifier:
- 875100
- Patent Number(s):
- 6531341
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81B - MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- method; fabricating; microelectronic; device; package; integral; window; providing; optical; access; aperture; multilayered; insulating; material; low-temperature; cofired; ceramic; ltcc; high-temperature; htcc; inserted; in-between; personalized; layers; green; tape; stackup; registration; baking; firing; simultaneously; bonded; sintered; densified; flip-chip; thick-film; metallized; traces; light-sensitive; optically; accessible; finally; cover; lid; attached; opposite; result; compact; low-profile; hermetically-sealed; ceramic layer; optical access; electronic device; /438/257/
Citation Formats
Peterson, Kenneth A, and Watson, Robert D. Method of fabricating a microelectronic device package with an integral window. United States: N. p., 2003.
Web.
Peterson, Kenneth A, & Watson, Robert D. Method of fabricating a microelectronic device package with an integral window. United States.
Peterson, Kenneth A, and Watson, Robert D. Wed .
"Method of fabricating a microelectronic device package with an integral window". United States. https://www.osti.gov/servlets/purl/875100.
@article{osti_875100,
title = {Method of fabricating a microelectronic device package with an integral window},
author = {Peterson, Kenneth A and Watson, Robert D},
abstractNote = {A method of fabricating a microelectronic device package with an integral window for providing optical access through an aperture in the package. The package is made of a multilayered insulating material, e.g., a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC). The window is inserted in-between personalized layers of ceramic green tape during stackup and registration. Then, during baking and firing, the integral window is simultaneously bonded to the sintered ceramic layers of the densified package. Next, the microelectronic device is flip-chip bonded to cofired thick-film metallized traces on the package, where the light-sensitive side is optically accessible through the window. Finally, a cover lid is attached to the opposite side of the package. The result is a compact, low-profile package, flip-chip bonded, hermetically-sealed package having an integral window.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Wed Jan 01 00:00:00 EST 2003},
month = {Wed Jan 01 00:00:00 EST 2003}
}